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因为,它是慢悠悠的,
2024年12月16日,待他稍稍稳住思绪,映入眼帘的,是令他一生都难以忘记的恐怖场面。垃圾袋里面装着的,是人类的残肢断臂,一块一块,码放整齐,犹如市场肉铺的商品。
《韩国悲惨事件》手机高清免费在线观看 - 红十字电影网《贵妃直播视频》完整版国语在线观看-苍南电影网
所以如果按照七零年代的一元钱也就相当于现在的100元钱而大家下馆子一般吃的都是荤菜毕竟下馆子吃素菜的话大家会认为很奢侈
2024-07-13 09:15·中科院之声PCB常见的专业术语(中英文对照)2021-11-20 09:48·西小沐雪PCB常见的专业术语(中英文对照)允许:permit制造:manufacture修改:revision公差:tolerance忽略:ignore(omit)工具孔:tooling hole安装孔:mounting hole元件孔:component hole槽孔:slot邮票孔:snap off hole导通孔:via盲孔:blind via埋孔:buried via金属化孔:PTH(plating through hole)非金属化孔:NPTH( no plating through hole)孔位:hole location避免:avoid原设计:original design修改:modify按原设计:leave it as it is附边:waste tab铜条:copper strip拼板强度:panel strong板厚:board thickness删除:remove(delete)削铜:shave the copper露铜:copper exposure光标点:fiducial mark不同:be different from(differ from)内弧:inside radius焊环:annular ring单板尺寸:single size拼板尺寸:panel size铣:routing铣刀:routerV-cut:scoring哑光:matt光亮的:glossy锡珠:solder ball(solder plugs)常用PCB 专业术语阻焊:solder mask(solder resist)阻焊开窗:solder mask opening单面开窗:single side mask opening补油:touch up solder mask补线:track welds毛刺:burrs去毛刺:deburr镀层厚度:plating thickness清洁度:cleanliness离子污染:ionic contamination阻燃性:flammability retardant黑化:black oxidation棕化:brown oxidation红化:red oxidation可焊性:solderability焊料:solder包装:packaging角标:corner mark特性阻抗:characteristic impedance正像:positive负片:negative镜像:mirror线宽:conductor width线距:conductor spacing做样:build sample按照:as per成品:finished做变更:make the chang相类似:similar to规格:specification下移:shift down垂直地:vertically水平的:horizontally增大:increase缩小:decrease表面处理:Surface Finishing波峰焊:wave solder钻孔数据:drilling date标记:Logo Ul标记:Ul Marking蚀刻标记:etched marking周期:date code翘曲:bow and twist外层:outer layer内层:internal layer顶层:top layer底层:bottom layer元件面:component side焊接面:solder side阻焊层:solder mask layer丝印层:legend layer (silkscreen layer or over layer)兰胶层:peelable SM layer贴片层:paste mask layer碳油层:carbon layer外形层:outline layer(profile layer)白油:white ink绿油:green ink喷锡:hot air leveling (HAL)水金:flash gold插头镀金:plated gold edge-board contacts金手指:Gold-finger防氧化:Entek(OSP)沉金:Immersion gold (chem. Gold)沉锡:Immersion Tin(chem.Tin)沉银:Immersion Silver (chem. silver)铣:CNC (mill , routing)冲:punching倒角:beveling倒斜角:chamfer倒圆角:fillet尺寸:dimension(深亚电子工程师小亚,整理于网络)