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电(Dian)子(Zi)专(Zhuan)业(Ye)单(Dan)词(Ci)手(Shou)册(Ce)2018-11-23 09:13·遇(Yu)见(Jian)尘(Chen)都(Du)专(Zhuan)业(Ye)英(Ying)语(Yu)词(Ci)汇(Hui)，电(Dian)子(Zi)业(Ye)的(De)红(Hong)宝(Bao)书(Shu)1 backplane 背(Bei)板(Ban)2 Band gap voltage reference 带(Dai)隙(Xi)电(Dian)压(Ya)参(Can)考(Kao)3 benchtop supply 工(Gong)作(Zuo)台(Tai)电(Dian)源(Yuan)4 Block Diagram 方(Fang)块(Kuai)图(Tu)5 Bode Plot 波(Bo)特(Te)图(Tu)6 Bootstrap 自(Zi)举(Ju)7 Bottom FET Bottom FET8 bucket capcitor 桶(Tong)形(Xing)电(Dian)容(Rong)9 chassis 机(Ji)架(Jia)10 Combi-sense Combi-sense11 constant current source 恒(Heng)流(Liu)源(Yuan)12 Core Sataration 铁(Tie)芯(Xin)饱(Bao)和(He)13 crossover frequency 交(Jiao)叉(Cha)频(Pin)率(Lv)14 current ripple 纹(Wen)波(Bo)电(Dian)流(Liu)15 Cycle by Cycle 逐(Zhu)周(Zhou)期(Qi)16 cycle skipping 周(Zhou)期(Qi)跳(Tiao)步(Bu)17 Dead Time 死(Si)区(Qu)时(Shi)间(Jian)18 DIE Temperature 核(He)心(Xin)温(Wen)度(Du)19 Disable 非(Fei)使(Shi)能(Neng)，无(Wu)效(Xiao)，禁(Jin)用(Yong)，关(Guan)断(Duan)20 dominant pole 主(Zhu)极(Ji)点(Dian)21 Enable 使(Shi)能(Neng)，有(You)效(Xiao)，启(Qi)用(Yong)22 ESD Rating ESD额(E)定(Ding)值(Zhi)23 Evaluation Board 评(Ping)估(Gu)板(Ban)24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction.Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 超(Chao)过(Guo)下(Xia)面(Mian)的(De)规(Gui)格(Ge)使(Shi)用(Yong)可(Ke)能(Neng)引(Yin)起(Qi)永(Yong)久(Jiu)的(De)设(She)备(Bei)损(Sun)害(Hai)或(Huo)设(She)备(Bei)故(Gu)障(Zhang)。建(Jian)议(Yi)不(Bu)要(Yao)工(Gong)作(Zuo)在(Zai)电(Dian)特(Te)性(Xing)表(Biao)规(Gui)定(Ding)的(De)参(Can)数(Shu)范(Fan)围(Wei)以(Yi)外(Wai)。25 Failling edge 下(Xia)降(Jiang)沿(Yan)26 figure of merit 品(Pin)质(Zhi)因(Yin)数(Shu)27 float charge voltage 浮(Fu)充(Chong)电(Dian)压(Ya)28 flyback power stage 反(Fan)驰(Chi)式(Shi)功(Gong)率(Lv)级(Ji)29 forward voltage drop 前(Qian)向(Xiang)压(Ya)降(Jiang)30 free-running 自(Zi)由(You)运(Yun)行(Xing)31 Freewheel diode 续(Xu)流(Liu)二(Er)极(Ji)管(Guan)32 Full load 满(Man)负(Fu)载(Zai)33 gate drive 栅(Zha)极(Ji)驱(Qu)动(Dong)34 gate drive stage 栅(Zha)极(Ji)驱(Qu)动(Dong)级(Ji)35 gerber plot Gerber 图(Tu)36 ground plane 接(Jie)地(Di)层(Ceng)37 Henry 电(Dian)感(Gan)单(Dan)位(Wei)：亨(Heng)利(Li)38 Human BodyModel 人(Ren)体(Ti)模(Mo)式(Shi)39 Hysteresis 滞(Zhi)回(Hui)40 inrush current 涌(Yong)入(Ru)电(Dian)流(Liu)41 Inverting 反(Fan)相(Xiang)42 jittery 抖(Dou)动(Dong)43 Junction 结(Jie)点(Dian)44 Kelvin connection 开(Kai)尔(Er)文(Wen)连(Lian)接(Jie)45 Lead Frame 引(Yin)脚(Jiao)框(Kuang)架(Jia)46 Lead Free 无(Wu)铅(Qian)47 level-shift 电(Dian)平(Ping)移(Yi)动(Dong)48 Line regulation 电(Dian)源(Yuan)调(Diao)整(Zheng)率(Lv)49 load regulation 负(Fu)载(Zai)调(Diao)整(Zheng)率(Lv)50 Lot Number 批(Pi)号(Hao)51 Low Dropout 低(Di)压(Ya)差(Cha)52 Miller 密(Mi)勒(Le)53 node 节(Jie)点(Dian)54 Non-Inverting 非(Fei)反(Fan)相(Xiang)55 novel 新(Xin)颖(Ying)的(De)56 off state 关(Guan)断(Duan)状(Zhuang)态(Tai)57 Operating supply voltage 电(Dian)源(Yuan)工(Gong)作(Zuo)电(Dian)压(Ya)58 out drive stage 输(Shu)出(Chu)驱(Qu)动(Dong)级(Ji)59 Out of Phase 异(Yi)相(Xiang)60 Part Number 产(Chan)品(Pin)型(Xing)号(Hao)61 pass transistor pass transistor62 P-channel MOSFET P沟(Gou)道(Dao)MOSFET63 Phase margin 相(Xiang)位(Wei)裕(Yu)度(Du)64 Phase Node 开(Kai)关(Guan)节(Jie)点(Dian)65 portable electronics 便(Bian)携(Xie)式(Shi)电(Dian)子(Zi)设(She)备(Bei)66 power down 掉(Diao)电(Dian)67 Power Good 电(Dian)源(Yuan)正(Zheng)常(Chang)68 Power Groud 功(Gong)率(Lv)地(Di)69 Power Save Mode 节(Jie)电(Dian)模(Mo)式(Shi)70 Power up 上(Shang)电(Dian)71 pull down 下(Xia)拉(La)72 pull up 上(Shang)拉(La)73 Pulse by Pulse 逐(Zhu)脉(Mai)冲(Chong)（Pulse by Pulse）74 push pull converter 推(Tui)挽(Wan)转(Zhuan)换(Huan)器(Qi)75 ramp down 斜(Xie)降(Jiang)76 ramp up 斜(Xie)升(Sheng)77 redundant diode 冗(Rong)余(Yu)二(Er)极(Ji)管(Guan)78 resistive divider 电(Dian)阻(Zu)分(Fen)压(Ya)器(Qi)79 ringing 振(Zhen)铃(Ling)80 ripple current 纹(Wen)波(Bo)电(Dian)流(Liu)81 rising edge 上(Shang)升(Sheng)沿(Yan)82 sense resistor 检(Jian)测(Ce)电(Dian)阻(Zu)83 Sequenced Power Supplys 序(Xu)列(Lie)电(Dian)源(Yuan)84 shoot-through 直(Zhi)通(Tong)，同(Tong)时(Shi)导(Dao)通(Tong)85 stray inductances. 杂(Za)散(San)电(Dian)感(Gan)86 sub-circuit 子(Zi)电(Dian)路(Lu)87 substrate 基(Ji)板(Ban)88 Telecom 电(Dian)信(Xin)89 Thermal Information 热(Re)性(Xing)能(Neng)信(Xin)息(Xi)90 thermal slug 散(San)热(Re)片(Pian)91 Threshold 阈(Zuo)值(Zhi)92 timing resistor 振(Zhen)荡(Dang)电(Dian)阻(Zu)93 Top FET Top FET94 Trace 线(Xian)路(Lu)，走(Zou)线(Xian)，引(Yin)线(Xian)95 Transfer function 传(Chuan)递(Di)函(Han)数(Shu)96 Trip Point 跳(Tiao)变(Bian)点(Dian)97 turns ratio 匝(Za)数(Shu)比(Bi)，＝Np / Ns。（初(Chu)级(Ji)匝(Za)数(Shu)/次(Ci)级(Ji)匝(Za)数(Shu)）98 Under Voltage Lock Out (UVLO) 欠(Qian)压(Ya)锁(Suo)定(Ding)99 Voltage Reference 电(Dian)压(Ya)参(Can)考(Kao)100 voltage-second product 伏(Fu)秒(Miao)积(Ji)101 zero-pole frequency compensation 零(Ling)极(Ji)点(Dian)频(Pin)率(Lv)补(Bu)偿(Chang)102 beat frequency 拍(Pai)频(Pin)103 one shots 单(Dan)击(Ji)电(Dian)路(Lu)104 scaling 缩(Suo)放(Fang)105 ESR 等(Deng)效(Xiao)串(Chuan)联(Lian)电(Dian)阻(Zu)106 Ground 地(Di)电(Dian)位(Wei)107 trimmed bandgap 平(Ping)衡(Heng)带(Dai)隙(Xi)108 dropout voltage 压(Ya)差(Cha)109 large bulk capacitance 大(Da)容(Rong)量(Liang)电(Dian)容(Rong)110 circuit breaker 断(Duan)路(Lu)器(Qi)111 charge pump 电(Dian)荷(He)泵(Beng)112 overshoot 过(Guo)冲(Chong)1） 元(Yuan)件(Jian)设(She)备(Bei)三(San)绕(Rao)组(Zu)变(Bian)压(Ya)器(Qi)：three-column transformer ThrClnTrans双(Shuang)绕(Rao)组(Zu)变(Bian)压(Ya)器(Qi)：double-column transformer DblClmnTrans电(Dian)容(Rong)器(Qi)：Capacitor并(Bing)联(Lian)电(Dian)容(Rong)器(Qi)：shunt capacitor电(Dian)抗(Kang)器(Qi)：Reactor母(Mu)线(Xian)：Busbar输(Shu)电(Dian)线(Xian)：TransmissionLine发(Fa)电(Dian)厂(Chang)：power plant断(Duan)路(Lu)器(Qi)：Breaker刀(Dao)闸(Zha)(隔(Ge)离(Li)开(Kai)关(Guan))：Isolator分(Fen)接(Jie)头(Tou)：tap电(Dian)动(Dong)机(Ji)：motor（2） 状(Zhuang)态(Tai)参(Can)数(Shu)有(You)功(Gong)：active power无(Wu)功(Gong)：reactive power电(Dian)流(Liu)：current容(Rong)量(Liang)：capacity电(Dian)压(Ya)：voltage档(Dang)位(Wei)：tap position有(You)功(Gong)损(Sun)耗(Hao)：reactive loss无(Wu)功(Gong)损(Sun)耗(Hao)：active loss功(Gong)率(Lv)因(Yin)数(Shu)：power-factor功(Gong)率(Lv)：power功(Gong)角(Jiao)：power-angle电(Dian)压(Ya)等(Deng)级(Ji)：voltage grade空(Kong)载(Zai)损(Sun)耗(Hao)：no-load loss铁(Tie)损(Sun)：iron loss铜(Tong)损(Sun)：copper loss空(Kong)载(Zai)电(Dian)流(Liu)：no-load current阻(Zu)抗(Kang)：impedance正(Zheng)序(Xu)阻(Zu)抗(Kang)：positive sequence impedance负(Fu)序(Xu)阻(Zu)抗(Kang)：negative sequence impedance零(Ling)序(Xu)阻(Zu)抗(Kang)：zero sequence impedance电(Dian)阻(Zu)：resistor电(Dian)抗(Kang)：reactance电(Dian)导(Dao)：conductance电(Dian)纳(Na)：susceptance无(Wu)功(Gong)负(Fu)载(Zai)：reactive load 或(Huo)者(Zhe)QLoad有(You)功(Gong)负(Fu)载(Zai): active load PLoad遥(Yao)测(Ce)：YC(telemetering)遥(Yao)信(Xin)：YX励(Li)磁(Ci)电(Dian)流(Liu)(转(Zhuan)子(Zi)电(Dian)流(Liu))：magnetizing current定(Ding)子(Zi)：stator功(Gong)角(Jiao)：power-angle上(Shang)限(Xian):upper limit下(Xia)限(Xian)：lower limit并(Bing)列(Lie)的(De)：apposable高(Gao)压(Ya): high voltage低(Di)压(Ya)：low voltage中(Zhong)压(Ya)：middle voltage电(Dian)力(Li)系(Xi)统(Tong)power system发(Fa)电(Dian)机(Ji)generator励(Li)磁(Ci) excitation励(Li)磁(Ci)器(Qi)excitor电(Dian)压(Ya) voltage电(Dian)流(Liu) current母(Mu)线(Xian) bus变(Bian)压(Ya)器(Qi)transformer升(Sheng)压(Ya)变(Bian)压(Ya)器(Qi)step-up 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time极(Ji)限(Xian)切(Qie)除(Chu)时(Shi)间(Jian)critical clearing time切(Qie)机(Ji)generator triping高(Gao)顶(Ding)值(Zhi)high limited value强(Qiang)行(Xing)励(Li)磁(Ci)reinforced excitation线(Xian)路(Lu)补(Bu)偿(Chang)器(Qi)LDC(line drop compensation)机(Ji)端(Duan)generator terminal静(Jing)态(Tai)static (state)动(Dong)态(Tai) dynamic (state)单(Dan)机(Ji)无(Wu)穷(Qiong)大(Da)系(Xi)统(Tong)one machine - infinity bus system机(Ji)端(Duan)电(Dian)压(Ya)控(Kong)制(Zhi)AVR电(Dian)抗(Kang)reactance电(Dian)阻(Zu)resistance功(Gong)角(Jiao)power angle有(You)功(Gong)（功(Gong)率(Lv)） active power无(Wu)功(Gong)（功(Gong)率(Lv)） reactive power功(Gong)率(Lv)因(Yin)数(Shu)power factor无(Wu)功(Gong)电(Dian)流(Liu)reactive current下(Xia)降(Jiang)特(Te)性(Xing)droop characteristics斜(Xie)率(Lv)slope额(E)定(Ding) rating变(Bian)比(Bi) ratio参(Can)考(Kao)值(Zhi)reference value电(Dian)压(Ya)互(Hu)感(Gan)器(Qi)PT分(Fen)接(Jie)头(Tou)tap下(Xia)降(Jiang)率(Lv)droop rate仿(Fang)真(Zhen)分(Fen)析(Xi)simulation analysis传(Chuan)递(Di)函(Han)数(Shu)transfer function框(Kuang)图(Tu)block diagram受(Shou)端(Duan) receive-side裕(Yu)度(Du)margin同(Tong)步(Bu)synchronization失(Shi)去(Qu)同(Tong)步(Bu)loss of synchronization阻(Zu)尼(Ni)damping摇(Yao)摆(Bai) swing保(Bao)护(Hu)断(Duan)路(Lu)器(Qi)circuit breaker电(Dian)阻(Zu)：resistance电(Dian)抗(Kang)：reactance阻(Zu)抗(Kang)：impedance电(Dian)导(Dao)：conductance电(Dian)纳(Na)：susceptance导(Dao)纳(Na)：admittance电(Dian)感(Gan)：inductance电(Dian)容(Rong): capacitancecoupling 耦(Zuo)合(He)intermittent 周(Zhou)期(Qi)的(De)dislocation 错(Cuo)位(Wei)propeller 螺(Luo)旋(Xuan)桨(Jiang)switchgear 配(Pei)电(Dian)装(Zhuang)置(Zhi)dispersion 差(Cha)量(Liang)flange 法(Fa)兰(Lan)盘(Pan)dielectric 介(Jie)电(Dian)的(De)binder 胶(Jiao)合(He)剂(Ji)alignment 定(Ding)位(Wei)elastomer 合(He)成(Cheng)橡(Xiang)胶(Jiao)corollary 必(Bi)然(Ran)的(De)结(Jie)果(Guo)rabbet 插(Cha)槽(Cao)vent 通(Tong)风(Feng)孔(Kong)subtle 敏(Min)感(Gan)的(De)gearbox 变(Bian)速(Su)箱(Xiang)plate 电(Dian)镀(Du)crucial 决(Jue)定(Ding)性(Xing)的(De)flexible 柔(Rou)性(Xing)的(De)technics 工(Gong)艺(Yi)ultimate 最(Zui)终(Zhong)的(De)resilience 弹(Dan)性(Xing)vendor 自(Zi)动(Dong)售(Shou)货(Huo)机(Ji)partition 分(Fen)类(Lei)rigid 刚(Gang)性(Xing)的(De)prototype 样(Yang)机(Ji)diagram 特(Te)性(Xing)曲(Qu)线(Xian)interfere 干(Gan)涉(She)compatible 兼(Jian)容(Rong)的(De)simulation 模(Mo)拟(Ni)clutch 离(Li)合(He)器(Qi)refinement 精(Jing)加(Jia)工(Gong)fixture 夹(Jia)具(Ju)torque 扭(Niu)矩(Ju)responsive 敏(Min)感(Gan)的(De)tensile 拉(La)伸(Shen)cushion 减(Jian)震(Zhen)器(Qi)rib 肋(Lei)strength 强(Qiang)度(Du)packing 包(Bao)装(Zhuang)metallized 金(Jin)属(Shu)化(Hua)stress 应(Ying)力(Li)mitigate 减(Jian)轻(Qing)trade off 折(Zhe)衷(Zhong)方(Fang)案(An)yield 屈(Qu)伸(Shen)line shaft 中(Zhong)间(Jian)轴(Zhou)matrix 母(Mu)体(Ti)inherent 固(Gu)有(You)的(De)spindle 主(Zhu)轴(Zhou)aperture 孔(Kong)径(Jing)conformance 适(Shi)应(Ying)性(Xing)axle 心(Xin)轴(Zhou)turbulence 扰(Rao)动(Dong)specification 规(Gui)范(Fan)semipermanent 半(Ban)永(Yong)久(Jiu)性(Xing)的(De)enclosure 机(Ji)壳(Ke)specialization 规(Gui)范(Fan)化(Hua)bolt 螺(Luo)栓(Shuan)oscillation 振(Zhen)幅(Fu)calling 职(Zhi)业(Ye)nut 螺(Luo)母(Mu)anneal 退(Tui)火(Huo)vitalize 激(Ji)发(Fa)screw 螺(Luo)丝(Si)polymer 聚(Ju)合(He)体(Ti)revelation 揭(Jie)示(Shi)fastner 紧(Jin)固(Gu)件(Jian)bind 凝(Ning)固(Gu)dissemination 分(Fen)发(Fa)rivit 铆(Mao)钉(Ding)mount 支(Zhi)架(Jia)booster 推(Tui)进(Jin)器(Qi)hub 轴(Zhou)套(Tao)distortion 变(Bian)形(Xing)contractual 契(Qi)约(Yue)的(De)coaxial 同(Tong)心(Xin)的(De)module 模(Mo)块(Kuai)verdict 裁(Cai)决(Jue)crank 曲(Qu)柄(Bing)slide 滑(Hua)块(Kuai)malfunction 故(Gu)障(Zhang)inertia 惰(Duo)性(Xing)medium 介(Jie)质(Zhi)allegedly 假(Jia)定(Ding)active 活(Huo)性(Xing)的(De)dissipation 损(Sun)耗(Hao)controversy 辩(Bian)论(Lun)lubrication 润(Run)滑(Hua)assembly 总(Zong)装(Zhuang)dictate 支(Zhi)配(Pei)graphite 石(Shi)墨(Mo)encapsulate 封(Feng)装(Zhuang)incumbent 义(Yi)不(Bu)容(Rong)辞(Ci)的(De)derivative 派(Pai)生(Sheng)物(Wu)adhesive 粘(Zhan)合(He)剂(Ji)validation 使(Shi)生(Sheng)效(Xiao)contaminate 沾(Zhan)染(Ran)turbine 涡(Wo)轮(Lun)procurement 收(Shou)购(Gou)asperity 粗(Cu)糙(Cao)bearing 支(Zhi)撑(Cheng)架(Jia)mortality 失(Shi)败(Bai)率(Lv)metalworking 金(Jin)属(Shu)加(Jia)工(Gong)isostatic 均(Jun)衡(Heng)的(De)shed light on 阐(Chan)明(Ming)viscous 粘(Zhan)稠(Chou)的(De)osculate 接(Jie)触(Chu)adversely 有(You)害(Hai)的(De)grinding 研(Yan)磨(Mo)imperative 强(Qiang)制(Zhi)的(De)consistency 连(Lian)续(Xu)性(Xing)corrosin 侵(Qin)蚀(Shi)lattice 晶(Jing)格(Ge)fitness 适(Shi)应(Ying)性(Xing)flush 冲(Chong)洗(Xi)fracture 断(Duan)裂(Lie)warrant 保(Bao)证(Zheng)inhibitor 防(Fang)腐(Fu)剂(Ji)diffusivity 扩(Kuo)散(San)率(Lv)turning 车(Che)工(Gong)dispersant 分(Fen)散(San)剂(Ji)vice versa 反(Fan)之(Zhi)亦(Yi)然(Ran)ways 导(Dao)轨(Gui)deteriorate 降(Jiang)低(Di)tribological 摩(Mo)擦(Ba)的(De)hybrid 混(Hun)合(He)物(Wu)neutralize 平(Ping)衡(Heng)screen 屏(Ping)蔽(Bi)ID=inside diameterpulley 滑(Hua)轮(Lun)exclusion 隔(Ge)绝(Jue)OD=outside diameterhydraulic 液(Ye)压(Ya)的(De)insulation 绝(Jue)缘(Yuan)reciprocate 往(Wang)复(Fu)运(Yun)动(Dong)delicate 精(Jing)密(Mi)的(De)elaborate 加(Jia)工(Gong)dress 精(Jing)整(Zheng)dampen 阻(Zu)尼(Ni)incontrovertible 无(Wu)可(Ke)争(Zheng)议(Yi)的(De)by and large 大(Da)体(Ti)上(Shang)pivotal 中(Zhong)枢(Shu)的(De)luminous 发(Fa)光(Guang)的(De)plastic 塑(Su)胶(Jiao)utilitarian 功(Gong)利(Li)主(Zhu)义(Yi)out of round 失(Shi)园(Yuan)organic 有(You)机(Ji)的(De)grass root 基(Ji)层(Ceng)premature 过(Guo)早(Zao)的(De)film 薄(Bao)膜(Mo)state-of-the -art 技(Ji)术(Shu)发(Fa)展(Zhan)水(Shui)平(Ping)guard 防(Fang)护(Hu)罩(Zhao)polyester 聚(Ju)酯(Zuo)blade 托(Tuo)板(Ban)permeate 渗(Shen)入(Ru)epoxy 环(Huan)氧(Yang)的(De)carrier 载(Zai)体(Ti)spillage 溢(Yi)出(Chu)polypropylene 聚(Ju)丙(Bing)烯(Xi)chuck 卡(Ka)盘(Pan)erosion 浸(Jin)蚀(Shi)photoconductive 光(Guang)敏(Min)的(De)infeed 横(Heng)向(Xiang)进(Jin)给(Gei)routine 程(Cheng)序(Xu)miniaturization 小(Xiao)型(Xing)化(Hua)lapping 抛(Pao)光(Guang)postprocess 后(Hou)置(Zhi)处(Chu)理(Li)asynchronism 异(Yi)步(Bu)milling 洗(Xi)削(Xiao)solder-bump 焊(Han)点(Dian)synchronization 同(Tong)步(Bu)speciality 专(Zhuan)业(Ye)grid 栅(Zha)格(Ge)respond 响(Xiang)应(Ying)stroke 行(Xing)程(Cheng)impedance 阻(Zu)抗(Kang)feedback 反(Fan)馈(Kui)attachment 备(Bei)件(Jian)approximately 大(Da)约(Yue)aberrance 畸(Ji)变(Bian)tapered 楔(Xie)形(Xing)的(De)purported 据(Ju)说(Shuo)steady 稳(Wen)态(Tai)的(De)casting 铸(Zhu)件(Jian)consumable 消(Xiao)费(Fei)品(Pin)dynamic 动(Dong)态(Tai)的(De)index 换(Huan)档(Dang)inductance 电(Dian)感(Gan)transient 瞬(Shun)态(Tai)的(De)stop 挡(Dang)块(Kuai)capacitance 电(Dian)容(Rong)coordinate 坐(Zuo)标(Biao)contour 轮(Lun)廓(Kuo)resistance 电(Dian)容(Rong)curve 曲(Qu)线(Xian)machine center 加(Jia)工(Gong)中(Zhong)心(Xin)audion 三(San)极(Ji)管(Guan)diagram 特(Te)性(Xing)曲(Qu)线(Xian)capitalize 投(Tou)资(Zi)diode 二(Er)极(Ji)管(Guan)history 关(Guan)系(Xi)曲(Qu)线(Xian)potentiometer 电(Dian)位(Wei)器(Qi)transistor 晶(Jing)体(Ti)管(Guan)gradient 斜(Xie)率(Lv)know-how 实(Shi)践(Jian)知(Zhi)识(Shi)choker 扼(E)流(Liu)圈(Quan)parabola 抛(Pao)物(Wu)线(Xian)potted 封(Feng)装(Zhuang)的(De)filter 滤(Lv)波(Bo)器(Qi)root 根(Gen)mechatronics 机(Ji)电(Dian)一(Yi)体(Ti)化(Hua)transformer 变(Bian)压(Ya)器(Qi)eigenvalue 特(Te)征(Zheng)值(Zhi)stem from 起(Qi)源(Yuan)于(Yu)fuse 保(Bao)险(Xian)丝(Si)function 函(Han)数(Shu)rule-based 基(Ji)于(Yu)规(Gui)则(Ze)的(De)annular core 磁(Ci)环(Huan)vector 向(Xiang)量(Liang)consolidation 巩(Gong)固(Gu)radiator 散(San)热(Re)器(Qi)reciprocal 倒(Dao)数(Shu)energize 激(Ji)发(Fa)regulator 稳(Wen)压(Ya)器(Qi)virtual value 有(You)效(Xiao)值(Zhi)synchronous 同(Tong)时(Shi)发(Fa)生(Sheng)bobbin 骨(Gu)架(Jia)square root 平(Ping)方(Fang)根(Gen)socket 插(Cha)孔(Kong)tape 胶(Jiao)带(Dai)cube 立(Li)方(Fang)polarity 极(Ji)性(Xing)ceramic capacitor 瓷(Ci)片(Pian)电(Dian)容(Rong)integral 积(Ji)分(Fen)armature 电(Dian)枢(Shu)electrolytic C 电(Dian)解(Jie)电(Dian)容(Rong)differential 微(Wei)分(Fen)installment 分(Fen)期(Qi)付(Fu)款(Kuan)self-tapping screw 自(Zi)攻(Gong)螺(Luo)丝(Si)hisgram 直(Zhi)方(Fang)图(Tu)lobe 凸(Tu)起(Qi)footprint 封(Feng)装(Zhuang)ratio 比(Bi)率(Lv)plunge 钻(Zuan)入(Ru)resin 松(Song)香(Xiang)grade down 成(Cheng)比(Bi)例(Li)降(Jiang)低(Di)servo 伺(Si)服(Fu)机(Ji)构(Gou)solderability 可(Ke)焊(Han)性(Xing)proportion 比(Bi)例(Li)dedicated 专(Zhuan)用(Yong)的(De)shock 机(Ji)械(Xie)冲(Chong)击(Ji)inverse ratio 反(Fan)比(Bi)interpolation 插(Cha)补(Bu)endurance 耐(Nai)久(Jiu)性(Xing)direct ratio 正(Zheng)比(Bi)compensation 校(Xiao)正(Zheng)initial value 初(Chu)始(Shi)值(Zhi)plus 加(Jia)upload 加(Jia)载(Zai)flashing 飞(Fei)弧(Hu)subtract 减(Jian)overload 过(Guo)载(Zai)canned 千(Qian)篇(Pian)一(Yi)律(Lv)的(De)multiply 乘(Cheng)lightload 轻(Qing)载(Zai)lot 抽(Chou)签(Qian)divide 除(Chu)stagger 交(Jiao)错(Cuo)排(Pai)列(Lie)parallel 并(Bing)联(Lian)impedance 阻(Zu)抗(Kang)traverse 横(Heng)向(Xiang)in series 串(Chuan)联(Lian)damp 阻(Zu)尼(Ni)longitudinal 纵(Zong)向(Xiang)的(De)equivalent 等(Deng)效(Xiao)的(De)reactance 电(Dian)抗(Kang)latitudinal 横(Heng)向(Xiang)的(De)terminal 终(Zhong)端(Duan)admittance 导(Dao)纳(Na)restrain 约(Yue)束(Shu)creep 蠕(Ru)动(Dong)susceptance 电(Dian)纳(Na)square 平(Ping)方(Fang)Hyperlink 超(Chao)级(Ji)连(Lian)接(Jie)spring 触(Chu)发(Fa)memo 备(Bei)忘(Wang)录(Lu)wastage 损(Sun)耗(Hao)presentation 陈(Chen)述(Shu)principle 原(Yuan)理(Li)binder 打(Da)包(Bao)planer 刨(Pao)床(Chuang)source program 源(Yuan)程(Cheng)序(Xu)Client-Server Model客(Ke)户(Hu)机(Ji)server 服(Fu)务(Wu)器(Qi)table 表(Biao)query 查(Cha)询(Xun)form 表(Biao)单(Dan)report 报(Bao)表(Biao)macro 宏(Hong)module 模(Mo)块(Kuai)field 字(Zi)段(Duan)record 记(Ji)录(Lu)printed circuit 印(Yin)制(Zhi)电(Dian)路(Lu)printed wiring 印(Yin)制(Zhi)线(Xian)路(Lu)printed board 印(Yin)制(Zhi)板(Ban)printed circuit board 印(Yin)制(Zhi)板(Ban)电(Dian)路(Lu)printed wiring board 印(Yin)制(Zhi)线(Xian)路(Lu)板(Ban)printed component 印(Yin)制(Zhi)元(Yuan)件(Jian)printed contact 印(Yin)制(Zhi)接(Jie)点(Dian)printed board assembly 印(Yin)制(Zhi)板(Ban)装(Zhuang)配(Pei)board 板(Ban)rigid printed board 刚(Gang)性(Xing)印(Yin)制(Zhi)板(Ban)flexible printed circuit 挠(Nao)性(Xing)印(Yin)制(Zhi)电(Dian)路(Lu)flexible printed wiring 挠(Nao)性(Xing)印(Yin)制(Zhi)线(Xian)路(Lu)flush printed board 齐(Qi)平(Ping)印(Yin)制(Zhi)板(Ban)metal core printed board 金(Jin)属(Shu)芯(Xin)印(Yin)制(Zhi)板(Ban)metal base printed board 金(Jin)属(Shu)基(Ji)印(Yin)制(Zhi)板(Ban)mulit-wiring printed board 多(Duo)重(Zhong)布(Bu)线(Xian)印(Yin)制(Zhi)板(Ban)molded circuit board 模(Mo)塑(Su)电(Dian)路(Lu)板(Ban)discrete wiring board 散(San)线(Xian)印(Yin)制(Zhi)板(Ban)micro wire board 微(Wei)线(Xian)印(Yin)制(Zhi)板(Ban)buile-up printed board 积(Ji)层(Ceng)印(Yin)制(Zhi)板(Ban)surface laminar circuit 表(Biao)面(Mian)层(Ceng)合(He)电(Dian)路(Lu)板(Ban)B2it printed board 埋(Mai)入(Ru)凸(Tu)块(Kuai)连(Lian)印(Yin)制(Zhi)板(Ban)chip on board 载(Zai)芯(Xin)片(Pian)板(Ban)buried resistance board 埋(Mai)电(Dian)阻(Zu)板(Ban)mother board 母(Mu)板(Ban)daughter board 子(Zi)板(Ban)backplane 背(Bei)板(Ban)bare board 裸(Luo)板(Ban)copper-invar-copper board 键(Jian)盘(Pan)板(Ban)夹(Jia)心(Xin)板(Ban)dynamic flex board 动(Dong)态(Tai)挠(Nao)性(Xing)板(Ban)static flex board 静(Jing)态(Tai)挠(Nao)性(Xing)板(Ban)break-away planel 可(Ke)断(Duan)拼(Pin)板(Ban)cable 电(Dian)缆(Lan)flexible flat cable (FFC) 挠(Nao)性(Xing)扁(Bian)平(Ping)电(Dian)缆(Lan)membrane switch 薄(Bao)膜(Mo)开(Kai)关(Guan)hybrid circuit 混(Hun)合(He)电(Dian)路(Lu)thick film 厚(Hou)膜(Mo)thick film circuit 厚(Hou)膜(Mo)电(Dian)路(Lu)thin film 薄(Bao)膜(Mo)thin film hybrid circuit 薄(Bao)膜(Mo)混(Hun)合(He)电(Dian)路(Lu)interconnection 互(Hu)连(Lian)conductor trace line 导(Dao)线(Xian)flush conductor 齐(Qi)平(Ping)导(Dao)线(Xian)transmission line 传(Chuan)输(Shu)线(Xian)crossover 跨(Kua)交(Jiao)edge-board contact 板(Ban)边(Bian)插(Cha)头(Tou)stiffener 增(Zeng)强(Qiang)板(Ban)substrate 基(Ji)底(Di)real estate 基(Ji)板(Ban)面(Mian)conductor side 导(Dao)线(Xian)面(Mian)component side 元(Yuan)件(Jian)面(Mian)solder side 焊(Han)接(Jie)面(Mian)printing 印(Yin)制(Zhi)grid 网(Wang)格(Ge)pattern 图(Tu)形(Xing)conductive pattern 导(Dao)电(Dian)图(Tu)形(Xing)non-conductive pattern 非(Fei)导(Dao)电(Dian)图(Tu)形(Xing)legend 字(Zi)符(Fu)mark 标(Biao)志(Zhi)base material 基(Ji)材(Cai)laminate 层(Ceng)压(Ya)板(Ban)metal-clad bade material 覆(Fu)金(Jin)属(Shu)箔(Bo)基(Ji)材(Cai)copper-clad laminate (CCL) 覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)composite laminate 复(Fu)合(He)层(Ceng)压(Ya)板(Ban)thin laminate 薄(Bao)层(Ceng)压(Ya)板(Ban)basis material 基(Ji)体(Ti)材(Cai)料(Liao)prepreg 预(Yu)浸(Jin)材(Cai)料(Liao)bonding sheet 粘(Zhan)结(Jie)片(Pian)preimpregnated bonding sheer 预(Yu)浸(Jin)粘(Zhan)结(Jie)片(Pian)epoxy glass substrate 环(Huan)氧(Yang)玻(Bo)璃(Li)基(Ji)板(Ban)mass lamination panel 预(Yu)制(Zhi)内(Nei)层(Ceng)覆(Fu)箔(Bo)板(Ban)core material 内(Nei)层(Ceng)芯(Xin)板(Ban)bonding layer 粘(Zhan)结(Jie)层(Ceng)film adhesive 粘(Zhan)结(Jie)膜(Mo)unsupported adhesive film 无(Wu)支(Zhi)撑(Cheng)胶(Jiao)粘(Zhan)剂(Ji)膜(Mo)cover layer (cover lay) 覆(Fu)盖(Gai)层(Ceng)stiffener material 增(Zeng)强(Qiang)板(Ban)材(Cai)copper-clad surface 铜(Tong)箔(Bo)面(Mian)foil removal surface 去(Qu)铜(Tong)箔(Bo)面(Mian)unclad laminate surface 层(Ceng)压(Ya)板(Ban)面(Mian)base film surface 基(Ji)膜(Mo)面(Mian)adhesive faec 胶(Jiao)粘(Zhan)剂(Ji)面(Mian)plate finish 原(Yuan)始(Shi)光(Guang)洁(Jie)面(Mian)matt finish 粗(Cu)面(Mian)length wise direction 纵(Zong)向(Xiang)cross wise direction 模(Mo)向(Xiang)cut to size panel 剪(Jian)切(Qie)板(Ban)ultra thin laminate 超(Chao)薄(Bao)型(Xing)层(Ceng)压(Ya)板(Ban)A-stage resin A阶(Jie)树(Shu)脂(Zhi)B-stage resin B阶(Jie)树(Shu)脂(Zhi)C-stage resin C阶(Jie)树(Shu)脂(Zhi)epoxy resin 环(Huan)氧(Yang)树(Shu)脂(Zhi)phenolic resin 酚(Fen)醛(Quan)树(Shu)脂(Zhi)polyester resin 聚(Ju)酯(Zuo)树(Shu)脂(Zhi)polyimide resin 聚(Ju)酰(Zuo)亚(Ya)胺(An)树(Shu)脂(Zhi)bismaleimide-triazine resin 双(Shuang)马(Ma)来(Lai)酰(Zuo)亚(Ya)胺(An)三(San)嗪(Zuo)树(Shu)脂(Zhi)acrylic resin 丙(Bing)烯(Xi)酸(Suan)树(Shu)脂(Zhi)melamine formaldehyde resin 三(San)聚(Ju)氰(Qing)胺(An)甲(Jia)醛(Quan)树(Shu)脂(Zhi)polyfunctional epoxy resin 多(Duo)官(Guan)能(Neng)环(Huan)氧(Yang)树(Shu)脂(Zhi)brominated epoxy resin 溴(Zuo)化(Hua)环(Huan)氧(Yang)树(Shu)脂(Zhi)epoxy novolac 环(Huan)氧(Yang)酚(Fen)醛(Quan)fluroresin 氟(Fu)树(Shu)脂(Zhi)silicone resin 硅(Gui)树(Shu)脂(Zhi)silane 硅(Gui)烷(Wan)polymer 聚(Ju)合(He)物(Wu)amorphous polymer 无(Wu)定(Ding)形(Xing)聚(Ju)合(He)物(Wu)crystalline polamer 结(Jie)晶(Jing)现(Xian)象(Xiang)dimorphism 双(Shuang)晶(Jing)现(Xian)象(Xiang)copolymer 共(Gong)聚(Ju)物(Wu)synthetic 合(He)成(Cheng)树(Shu)脂(Zhi)thermosetting resin 热(Re)固(Gu)性(Xing)树(Shu)脂(Zhi)thermoplastic resin 热(Re)塑(Su)性(Xing)树(Shu)脂(Zhi)photosensitive resin 感(Gan)光(Guang)性(Xing)树(Shu)脂(Zhi)epoxy value 环(Huan)氧(Yang)值(Zhi)dicyandiamide 双(Shuang)氰(Qing)胺(An)binder 粘(Zhan)结(Jie)剂(Ji)adesive 胶(Jiao)粘(Zhan)剂(Ji)curing agent 固(Gu)化(Hua)剂(Ji)flame retardant 阻(Zu)燃(Ran)剂(Ji)opaquer 遮(Zhe)光(Guang)剂(Ji)plasticizers 增(Zeng)塑(Su)剂(Ji)unsatuiated polyester 不(Bu)饱(Bao)和(He)聚(Ju)酯(Zuo)polyester 聚(Ju)酯(Zuo)薄(Bao)膜(Mo)polyimide film (PI) 聚(Ju)酰(Zuo)亚(Ya)胺(An)薄(Bao)膜(Mo)polytetrafluoetylene (PTFE) 聚(Ju)四(Si)氟(Fu)乙(Yi)烯(Xi)reinforcing material 增(Zeng)强(Qiang)材(Cai)料(Liao)glass fiber 玻(Bo)璃(Li)纤(Xian)维(Wei)E-glass fibre E玻(Bo)璃(Li)纤(Xian)维(Wei)D-glass fibre D玻(Bo)璃(Li)纤(Xian)维(Wei)S-glass fibre S玻(Bo)璃(Li)纤(Xian)维(Wei)glass fabric 玻(Bo)璃(Li)布(Bu)non-woven fabric 非(Fei)织(Zhi)布(Bu)glass mats 玻(Bo)璃(Li)纤(Xian)维(Wei)垫(Dian)yarn 纱(Sha)线(Xian)filament 单(Dan)丝(Si)strand 绞(Jiao)股(Gu)weft yarn 纬(Wei)纱(Sha)warp yarn 经(Jing)纱(Sha)denier 但(Dan)尼(Ni)尔(Er)warp-wise 经(Jing)向(Xiang)thread count 织(Zhi)物(Wu)经(Jing)纬(Wei)密(Mi)度(Du)weave structure 织(Zhi)物(Wu)组(Zu)织(Zhi)plain structure 平(Ping)纹(Wen)组(Zu)织(Zhi)grey fabric 坏(Huai)布(Bu)woven scrim 稀(Xi)松(Song)织(Zhi)物(Wu)bow of weave 弓(Gong)纬(Wei)end missing 断(Duan)经(Jing)mis-picks 缺(Que)纬(Wei)bias 纬(Wei)斜(Xie)crease 折(Zhe)痕(Hen)waviness 云(Yun)织(Zhi)fish eye 鱼(Yu)眼(Yan)feather length 毛(Mao)圈(Quan)长(Chang)mark 厚(Hou)薄(Bao)段(Duan)split 裂(Lie)缝(Feng)twist of yarn 捻(Nian)度(Du)size content 浸(Jin)润(Run)剂(Ji)含(Han)量(Liang)size residue 浸(Jin)润(Run)剂(Ji)残(Can)留(Liu)量(Liang)finish level 处(Chu)理(Li)剂(Ji)含(Han)量(Liang)size 浸(Jin)润(Run)剂(Ji)couplint agent 偶(Ou)联(Lian)剂(Ji)finished fabric 处(Chu)理(Li)织(Zhi)物(Wu)polyarmide fiber 聚(Ju)酰(Zuo)胺(An)纤(Xian)维(Wei)aromatic polyamide paper 聚(Ju)芳(Fang)酰(Zuo)胺(An)纤(Xian)维(Wei)纸(Zhi)breaking length 断(Duan)裂(Lie)长(Chang)height of capillary rise 吸(Xi)水(Shui)高(Gao)度(Du)wet strength retention 湿(Shi)强(Qiang)度(Du)保(Bao)留(Liu)率(Lv)whitenness 白(Bai)度(Du)ceramics 陶(Tao)瓷(Ci)conductive foil 导(Dao)电(Dian)箔(Bo)copper foil 铜(Tong)箔(Bo)rolled copper foil 压(Ya)延(Yan)铜(Tong)箔(Bo)annealed copper foil 退(Tui)火(Huo)铜(Tong)箔(Bo)thin copper foil 薄(Bao)铜(Tong)箔(Bo)adhesive coated foil 涂(Tu)胶(Jiao)铜(Tong)箔(Bo)resin coated copper foil 涂(Tu)胶(Jiao)脂(Zhi)铜(Tong)箔(Bo)composite metallic material 复(Fu)合(He)金(Jin)属(Shu)箔(Bo)carrier foil 载(Zai)体(Ti)箔(Bo)invar 殷(Yin)瓦(Wa)foil profile 箔(Bo)（剖(Po)面(Mian)）轮(Lun)廓(Kuo)shiny side 光(Guang)面(Mian)matte side 粗(Cu)糙(Cao)面(Mian)treated side 处(Chu)理(Li)面(Mian)stain proofing 防(Fang)锈(Xiu)处(Chu)理(Li)double treated foil 双(Shuang)面(Mian)处(Chu)理(Li)铜(Tong)箔(Bo)shematic diagram 原(Yuan)理(Li)图(Tu)logic diagram 逻(Luo)辑(Ji)图(Tu)printed wire layout 印(Yin)制(Zhi)线(Xian)路(Lu)布(Bu)设(She)master drawing 布(Bu)设(She)总(Zong)图(Tu)computer aided drawing 计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)制(Zhi)图(Tu)computer controlled display 计(Ji)算(Suan)机(Ji)控(Kong)制(Zhi)显(Xian)示(Shi)placement 布(Bu)局(Ju)routing 布(Bu)线(Xian)layout 布(Bu)图(Tu)设(She)计(Ji)rerouting 重(Zhong)布(Bu)simulation 模(Mo)拟(Ni)logic simulation 逻(Luo)辑(Ji)模(Mo)拟(Ni)circit simulation 电(Dian)路(Lu)模(Mo)拟(Ni)timing simulation 时(Shi)序(Xu)模(Mo)拟(Ni)modularization 模(Mo)块(Kuai)化(Hua)layout effeciency 布(Bu)线(Xian)完(Wan)成(Cheng)率(Lv)MDF databse 机(Ji)器(Qi)描(Miao)述(Shu)格(Ge)式(Shi)数(Shu)据(Ju)库(Ku)design database 设(She)计(Ji)数(Shu)据(Ju)库(Ku)design origin 设(She)计(Ji)原(Yuan)点(Dian)optimization (design) 优(You)化(Hua)（设(She)计(Ji)）predominant axis 供(Gong)设(She)计(Ji)优(You)化(Hua)坐(Zuo)标(Biao)轴(Zhou)table origin 表(Biao)格(Ge)原(Yuan)点(Dian)mirroring 镜(Jing)像(Xiang)drive file 驱(Qu)动(Dong)文(Wen)件(Jian)intermediate file 中(Zhong)间(Jian)文(Wen)件(Jian)manufacturing documentation 制(Zhi)造(Zao)文(Wen)件(Jian)queue support database 队(Dui)列(Lie)支(Zhi)撑(Cheng)数(Shu)据(Ju)库(Ku)component positioning 元(Yuan)件(Jian)安(An)置(Zhi)graphics dispaly 图(Tu)形(Xing)显(Xian)示(Shi)scaling factor 比(Bi)例(Li)因(Yin)子(Zi)scan filling 扫(Sao)描(Miao)填(Tian)充(Chong)rectangle filling 矩(Ju)形(Xing)填(Tian)充(Chong)region filling 填(Tian)充(Chong)域(Yu)physical design 实(Shi)体(Ti)设(She)计(Ji)logic design 逻(Luo)辑(Ji)设(She)计(Ji)logic circuit 逻(Luo)辑(Ji)电(Dian)路(Lu)hierarchical design 层(Ceng)次(Ci)设(She)计(Ji)top-down design 自(Zi)顶(Ding)向(Xiang)下(Xia)设(She)计(Ji)bottom-up design 自(Zi)底(Di)向(Xiang)上(Shang)设(She)计(Ji)net 线(Xian)网(Wang)digitzing 数(Shu)字(Zi)化(Hua)design rule checking 设(She)计(Ji)规(Gui)则(Ze)检(Jian)查(Cha)router (CAD) 走(Zou)（布(Bu)）线(Xian)器(Qi)net list 网(Wang)络(Luo)表(Biao)subnet 子(Zi)线(Xian)网(Wang)objective function 目(Mu)标(Biao)函(Han)数(Shu)post design processing (PDP) 设(She)计(Ji)后(Hou)处(Chu)理(Li)interactive drawing design 交(Jiao)互(Hu)式(Shi)制(Zhi)图(Tu)设(She)计(Ji)cost metrix 费(Fei)用(Yong)矩(Ju)阵(Zhen)engineering drawing 工(Gong)程(Cheng)图(Tu)block diagram 方(Fang)块(Kuai)框(Kuang)图(Tu)moze 迷(Mi)宫(Gong)component density 元(Yuan)件(Jian)密(Mi)度(Du)traveling salesman problem 回(Hui)售(Shou)货(Huo)员(Yuan)问(Wen)题(Ti)degrees freedom 自(Zi)由(You)度(Du)out going degree 入(Ru)度(Du)incoming degree 出(Chu)度(Du)manhatton distance 曼(Man)哈(Ha)顿(Dun)距(Ju)离(Li)euclidean distance 欧(Ou)几(Ji)里(Li)德(De)距(Ju)离(Li)network 网(Wang)络(Luo)array 阵(Zhen)列(Lie)segment 段(Duan)logic 逻(Luo)辑(Ji)logic design automation 逻(Luo)辑(Ji)设(She)计(Ji)自(Zi)动(Dong)化(Hua)separated time 分(Fen)线(Xian)separated layer 分(Fen)层(Ceng)definite sequence 定(Ding)顺(Shun)序(Xu)conduction (track) 导(Dao)线(Xian)（通(Tong)道(Dao)）conductor width 导(Dao)线(Xian)（体(Ti)）宽(Kuan)度(Du)conductor spacing 导(Dao)线(Xian)距(Ju)离(Li)conductor layer 导(Dao)线(Xian)层(Ceng)conductor line/space 导(Dao)线(Xian)宽(Kuan)度(Du)/间(Jian)距(Ju)conductor layer No.1 第(Di)一(Yi)导(Dao)线(Xian)层(Ceng)round pad 圆(Yuan)形(Xing)盘(Pan)square pad 方(Fang)形(Xing)盘(Pan)diamond pad 菱(Ling)形(Xing)盘(Pan)oblong pad 长(Chang)方(Fang)形(Xing)焊(Han)盘(Pan)bullet pad 子(Zi)弹(Dan)形(Xing)盘(Pan)teardrop pad 泪(Lei)滴(Di)盘(Pan)snowman pad 雪(Xue)人(Ren)盘(Pan)V-shaped pad V形(Xing)盘(Pan)annular pad 环(Huan)形(Xing)盘(Pan)non-circular pad 非(Fei)圆(Yuan)形(Xing)盘(Pan)isolation pad 隔(Ge)离(Li)盘(Pan)monfunctional pad 非(Fei)功(Gong)能(Neng)连(Lian)接(Jie)盘(Pan)offset land 偏(Pian)置(Zhi)连(Lian)接(Jie)盘(Pan)back-bard land 腹(Fu)（背(Bei)）裸(Luo)盘(Pan)anchoring spaur 盘(Pan)址(Zhi)land pattern 连(Lian)接(Jie)盘(Pan)图(Tu)形(Xing)land grid array 连(Lian)接(Jie)盘(Pan)网(Wang)格(Ge)阵(Zhen)列(Lie)annular ring 孔(Kong)环(Huan)component hole 元(Yuan)件(Jian)孔(Kong)mounting hole 安(An)装(Zhuang)孔(Kong)supported hole 支(Zhi)撑(Cheng)孔(Kong)unsupported hole 非(Fei)支(Zhi)撑(Cheng)孔(Kong)via 导(Dao)通(Tong)孔(Kong)plated through hole (PTH) 镀(Du)通(Tong)孔(Kong)access hole 余(Yu)隙(Xi)孔(Kong)blind via (hole) 盲(Mang)孔(Kong)buried via hole 埋(Mai)孔(Kong)buried blind via 埋(Mai),盲(Mang)孔(Kong)any layer inner via hole 任(Ren)意(Yi)层(Ceng)内(Nei)部(Bu)导(Dao)通(Tong)孔(Kong)all drilled hole 全(Quan)部(Bu)钻(Zuan)孔(Kong)toaling hole 定(Ding)位(Wei)孔(Kong)landless hole 无(Wu)连(Lian)接(Jie)盘(Pan)孔(Kong)interstitial hole 中(Zhong)间(Jian)孔(Kong)landless via hole 无(Wu)连(Lian)接(Jie)盘(Pan)导(Dao)通(Tong)孔(Kong)pilot hole 引(Yin)导(Dao)孔(Kong)terminal clearomee hole 端(Duan)接(Jie)全(Quan)隙(Xi)孔(Kong)dimensioned hole 准(Zhun)尺(Chi)寸(Cun)孔(Kong)via-in-pad 在(Zai)连(Lian)接(Jie)盘(Pan)中(Zhong)导(Dao)通(Tong)孔(Kong)hole location 孔(Kong)位(Wei)hole density 孔(Kong)密(Mi)度(Du)hole pattern 孔(Kong)图(Tu)drill drawing 钻(Zuan)孔(Kong)图(Tu)assembly drawing 装(Zhuang)配(Pei)图(Tu)datum referan 参(Can)考(Kao)基(Ji)准(Zhun)printed circuit 印(Yin)制(Zhi)电(Dian)路(Lu)printed wiring 印(Yin)制(Zhi)线(Xian)路(Lu)printed board 印(Yin)制(Zhi)板(Ban)printed circuit board 印(Yin)制(Zhi)板(Ban)电(Dian)路(Lu)printed wiring board 印(Yin)制(Zhi)线(Xian)路(Lu)板(Ban)printed component 印(Yin)制(Zhi)元(Yuan)件(Jian)printed contact 印(Yin)制(Zhi)接(Jie)点(Dian)printed board assembly 印(Yin)制(Zhi)板(Ban)装(Zhuang)配(Pei)board 板(Ban)rigid printed board 刚(Gang)性(Xing)印(Yin)制(Zhi)板(Ban)flexible printed circuit 挠(Nao)性(Xing)印(Yin)制(Zhi)电(Dian)路(Lu)flexible printed wiring 挠(Nao)性(Xing)印(Yin)制(Zhi)线(Xian)路(Lu)flush printed board 齐(Qi)平(Ping)印(Yin)制(Zhi)板(Ban)metal core printed board 金(Jin)属(Shu)芯(Xin)印(Yin)制(Zhi)板(Ban)metal base printed board 金(Jin)属(Shu)基(Ji)印(Yin)制(Zhi)板(Ban)mulit-wiring printed board 多(Duo)重(Zhong)布(Bu)线(Xian)印(Yin)制(Zhi)板(Ban)molded circuit board 模(Mo)塑(Su)电(Dian)路(Lu)板(Ban)discrete wiring board 散(San)线(Xian)印(Yin)制(Zhi)板(Ban)micro wire board 微(Wei)线(Xian)印(Yin)制(Zhi)板(Ban)buile-up printed board 积(Ji)层(Ceng)印(Yin)制(Zhi)板(Ban)surface laminar circuit 表(Biao)面(Mian)层(Ceng)合(He)电(Dian)路(Lu)板(Ban)B2it printed board 埋(Mai)入(Ru)凸(Tu)块(Kuai)连(Lian)印(Yin)制(Zhi)板(Ban)chip on board 载(Zai)芯(Xin)片(Pian)板(Ban)buried resistance board 埋(Mai)电(Dian)阻(Zu)板(Ban)mother board 母(Mu)板(Ban)daughter board 子(Zi)板(Ban)backplane 背(Bei)板(Ban)bare board 裸(Luo)板(Ban)copper-invar-copper board 键(Jian)盘(Pan)板(Ban)夹(Jia)心(Xin)板(Ban)dynamic flex board 动(Dong)态(Tai)挠(Nao)性(Xing)板(Ban)static flex board 静(Jing)态(Tai)挠(Nao)性(Xing)板(Ban)break-away planel 可(Ke)断(Duan)拼(Pin)板(Ban)cable 电(Dian)缆(Lan)flexible flat cable (FFC) 挠(Nao)性(Xing)扁(Bian)平(Ping)电(Dian)缆(Lan)membrane switch 薄(Bao)膜(Mo)开(Kai)关(Guan)hybrid circuit 混(Hun)合(He)电(Dian)路(Lu)thick film 厚(Hou)膜(Mo)thick film circuit 厚(Hou)膜(Mo)电(Dian)路(Lu)thin film 薄(Bao)膜(Mo)thin film hybrid circuit 薄(Bao)膜(Mo)混(Hun)合(He)电(Dian)路(Lu)interconnection 互(Hu)连(Lian)conductor trace line 导(Dao)线(Xian)flush conductor 齐(Qi)平(Ping)导(Dao)线(Xian)transmission line 传(Chuan)输(Shu)线(Xian)crossover 跨(Kua)交(Jiao)edge-board contact 板(Ban)边(Bian)插(Cha)头(Tou)stiffener 增(Zeng)强(Qiang)板(Ban)substrate 基(Ji)底(Di)real estate 基(Ji)板(Ban)面(Mian)conductor side 导(Dao)线(Xian)面(Mian)component side 元(Yuan)件(Jian)面(Mian)solder side 焊(Han)接(Jie)面(Mian)printing 印(Yin)制(Zhi)grid 网(Wang)格(Ge)pattern 图(Tu)形(Xing)conductive pattern 导(Dao)电(Dian)图(Tu)形(Xing)non-conductive pattern 非(Fei)导(Dao)电(Dian)图(Tu)形(Xing)legend 字(Zi)符(Fu)mark 标(Biao)志(Zhi)base material 基(Ji)材(Cai)laminate 层(Ceng)压(Ya)板(Ban)metal-clad bade material 覆(Fu)金(Jin)属(Shu)箔(Bo)基(Ji)材(Cai)copper-clad laminate (CCL) 覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)composite laminate 复(Fu)合(He)层(Ceng)压(Ya)板(Ban)thin laminate 薄(Bao)层(Ceng)压(Ya)板(Ban)basis material 基(Ji)体(Ti)材(Cai)料(Liao)prepreg 预(Yu)浸(Jin)材(Cai)料(Liao)bonding sheet 粘(Zhan)结(Jie)片(Pian)preimpregnated bonding sheer 预(Yu)浸(Jin)粘(Zhan)结(Jie)片(Pian)epoxy glass substrate 环(Huan)氧(Yang)玻(Bo)璃(Li)基(Ji)板(Ban)mass lamination panel 预(Yu)制(Zhi)内(Nei)层(Ceng)覆(Fu)箔(Bo)板(Ban)core material 内(Nei)层(Ceng)芯(Xin)板(Ban)bonding layer 粘(Zhan)结(Jie)层(Ceng)film adhesive 粘(Zhan)结(Jie)膜(Mo)unsupported adhesive film 无(Wu)支(Zhi)撑(Cheng)胶(Jiao)粘(Zhan)剂(Ji)膜(Mo)cover layer (cover lay) 覆(Fu)盖(Gai)层(Ceng)stiffener material 增(Zeng)强(Qiang)板(Ban)材(Cai)copper-clad surface 铜(Tong)箔(Bo)面(Mian)foil removal surface 去(Qu)铜(Tong)箔(Bo)面(Mian)unclad laminate surface 层(Ceng)压(Ya)板(Ban)面(Mian)base film surface 基(Ji)膜(Mo)面(Mian)adhesive faec 胶(Jiao)粘(Zhan)剂(Ji)面(Mian)plate finish 原(Yuan)始(Shi)光(Guang)洁(Jie)面(Mian)matt finish 粗(Cu)面(Mian)length wise direction 纵(Zong)向(Xiang)cross wise direction 模(Mo)向(Xiang)cut to size panel 剪(Jian)切(Qie)板(Ban)ultra thin laminate 超(Chao)薄(Bao)型(Xing)层(Ceng)压(Ya)板(Ban)A-stage resin A阶(Jie)树(Shu)脂(Zhi)B-stage resin B阶(Jie)树(Shu)脂(Zhi)C-stage resin C阶(Jie)树(Shu)脂(Zhi)epoxy resin 环(Huan)氧(Yang)树(Shu)脂(Zhi)phenolic resin 酚(Fen)醛(Quan)树(Shu)脂(Zhi)polyester resin 聚(Ju)酯(Zuo)树(Shu)脂(Zhi)polyimide resin 聚(Ju)酰(Zuo)亚(Ya)胺(An)树(Shu)脂(Zhi)bismaleimide-triazine resin 双(Shuang)马(Ma)来(Lai)酰(Zuo)亚(Ya)胺(An)三(San)嗪(Zuo)树(Shu)脂(Zhi)acrylic resin 丙(Bing)烯(Xi)酸(Suan)树(Shu)脂(Zhi)melamine formaldehyde resin 三(San)聚(Ju)氰(Qing)胺(An)甲(Jia)醛(Quan)树(Shu)脂(Zhi)polyfunctional epoxy resin 多(Duo)官(Guan)能(Neng)环(Huan)氧(Yang)树(Shu)脂(Zhi)brominated epoxy resin 溴(Zuo)化(Hua)环(Huan)氧(Yang)树(Shu)脂(Zhi)epoxy novolac 环(Huan)氧(Yang)酚(Fen)醛(Quan)fluroresin 氟(Fu)树(Shu)脂(Zhi)silicone resin 硅(Gui)树(Shu)脂(Zhi)silane 硅(Gui)烷(Wan)polymer 聚(Ju)合(He)物(Wu)amorphous polymer 无(Wu)定(Ding)形(Xing)聚(Ju)合(He)物(Wu)crystalline polamer 结(Jie)晶(Jing)现(Xian)象(Xiang)dimorphism 双(Shuang)晶(Jing)现(Xian)象(Xiang)copolymer 共(Gong)聚(Ju)物(Wu)synthetic 合(He)成(Cheng)树(Shu)脂(Zhi)thermosetting resin 热(Re)固(Gu)性(Xing)树(Shu)脂(Zhi)thermoplastic resin 热(Re)塑(Su)性(Xing)树(Shu)脂(Zhi)photosensitive resin 感(Gan)光(Guang)性(Xing)树(Shu)脂(Zhi)epoxy value 环(Huan)氧(Yang)值(Zhi)dicyandiamide 双(Shuang)氰(Qing)胺(An)binder 粘(Zhan)结(Jie)剂(Ji)adesive 胶(Jiao)粘(Zhan)剂(Ji)curing agent 固(Gu)化(Hua)剂(Ji)flame retardant 阻(Zu)燃(Ran)剂(Ji)opaquer 遮(Zhe)光(Guang)剂(Ji)plasticizers 增(Zeng)塑(Su)剂(Ji)unsatuiated polyester 不(Bu)饱(Bao)和(He)聚(Ju)酯(Zuo)polyester 聚(Ju)酯(Zuo)薄(Bao)膜(Mo)polyimide film (PI) 聚(Ju)酰(Zuo)亚(Ya)胺(An)薄(Bao)膜(Mo)polytetrafluoetylene (PTFE) 聚(Ju)四(Si)氟(Fu)乙(Yi)烯(Xi)reinforcing material 增(Zeng)强(Qiang)材(Cai)料(Liao)glass fiber 玻(Bo)璃(Li)纤(Xian)维(Wei)E-glass fibre E玻(Bo)璃(Li)纤(Xian)维(Wei)D-glass fibre D玻(Bo)璃(Li)纤(Xian)维(Wei)S-glass fibre S玻(Bo)璃(Li)纤(Xian)维(Wei)glass fabric 玻(Bo)璃(Li)布(Bu)non-woven fabric 非(Fei)织(Zhi)布(Bu)glass mats 玻(Bo)璃(Li)纤(Xian)维(Wei)垫(Dian)yarn 纱(Sha)线(Xian)filament 单(Dan)丝(Si)strand 绞(Jiao)股(Gu)weft yarn 纬(Wei)纱(Sha)warp yarn 经(Jing)纱(Sha)denier 但(Dan)尼(Ni)尔(Er)warp-wise 经(Jing)向(Xiang)thread count 织(Zhi)物(Wu)经(Jing)纬(Wei)密(Mi)度(Du)weave structure 织(Zhi)物(Wu)组(Zu)织(Zhi)plain structure 平(Ping)纹(Wen)组(Zu)织(Zhi)grey fabric 坏(Huai)布(Bu)woven scrim 稀(Xi)松(Song)织(Zhi)物(Wu)bow of weave 弓(Gong)纬(Wei)end missing 断(Duan)经(Jing)mis-picks 缺(Que)纬(Wei)bias 纬(Wei)斜(Xie)crease 折(Zhe)痕(Hen)waviness 云(Yun)织(Zhi)fish eye 鱼(Yu)眼(Yan)feather length 毛(Mao)圈(Quan)长(Chang)mark 厚(Hou)薄(Bao)段(Duan)split 裂(Lie)缝(Feng)twist of yarn 捻(Nian)度(Du)size content 浸(Jin)润(Run)剂(Ji)含(Han)量(Liang)size residue 浸(Jin)润(Run)剂(Ji)残(Can)留(Liu)量(Liang)finish level 处(Chu)理(Li)剂(Ji)含(Han)量(Liang)size 浸(Jin)润(Run)剂(Ji)couplint agent 偶(Ou)联(Lian)剂(Ji)finished fabric 处(Chu)理(Li)织(Zhi)物(Wu)polyarmide fiber 聚(Ju)酰(Zuo)胺(An)纤(Xian)维(Wei)aromatic polyamide paper 聚(Ju)芳(Fang)酰(Zuo)胺(An)纤(Xian)维(Wei)纸(Zhi)breaking length 断(Duan)裂(Lie)长(Chang)height of capillary rise 吸(Xi)水(Shui)高(Gao)度(Du)wet strength retention 湿(Shi)强(Qiang)度(Du)保(Bao)留(Liu)率(Lv)whitenness 白(Bai)度(Du)ceramics 陶(Tao)瓷(Ci)conductive foil 导(Dao)电(Dian)箔(Bo)copper foil 铜(Tong)箔(Bo)rolled copper foil 压(Ya)延(Yan)铜(Tong)箔(Bo)annealed copper foil 退(Tui)火(Huo)铜(Tong)箔(Bo)thin copper foil 薄(Bao)铜(Tong)箔(Bo)adhesive coated foil 涂(Tu)胶(Jiao)铜(Tong)箔(Bo)resin coated copper foil 涂(Tu)胶(Jiao)脂(Zhi)铜(Tong)箔(Bo)composite metallic material 复(Fu)合(He)金(Jin)属(Shu)箔(Bo)carrier foil 载(Zai)体(Ti)箔(Bo)invar 殷(Yin)瓦(Wa)foil profile 箔(Bo)（剖(Po)面(Mian)）轮(Lun)廓(Kuo)shiny side 光(Guang)面(Mian)matte side 粗(Cu)糙(Cao)面(Mian)treated side 处(Chu)理(Li)面(Mian)stain proofing 防(Fang)锈(Xiu)处(Chu)理(Li)double treated foil 双(Shuang)面(Mian)处(Chu)理(Li)铜(Tong)箔(Bo)shematic diagram 原(Yuan)理(Li)图(Tu)logic diagram 逻(Luo)辑(Ji)图(Tu)printed wire layout 印(Yin)制(Zhi)线(Xian)路(Lu)布(Bu)设(She)master drawing 布(Bu)设(She)总(Zong)图(Tu)computer aided drawing 计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)制(Zhi)图(Tu)computer controlled display 计(Ji)算(Suan)机(Ji)控(Kong)制(Zhi)显(Xian)示(Shi)placement 布(Bu)局(Ju)routing 布(Bu)线(Xian)layout 布(Bu)图(Tu)设(She)计(Ji)rerouting 重(Zhong)布(Bu)simulation 模(Mo)拟(Ni)logic simulation 逻(Luo)辑(Ji)模(Mo)拟(Ni)circit simulation 电(Dian)路(Lu)模(Mo)拟(Ni)timing simulation 时(Shi)序(Xu)模(Mo)拟(Ni)modularization 模(Mo)块(Kuai)化(Hua)layout effeciency 布(Bu)线(Xian)完(Wan)成(Cheng)率(Lv)MDF databse 机(Ji)器(Qi)描(Miao)述(Shu)格(Ge)式(Shi)数(Shu)据(Ju)库(Ku)design database 设(She)计(Ji)数(Shu)据(Ju)库(Ku)design origin 设(She)计(Ji)原(Yuan)点(Dian)optimization (design) 优(You)化(Hua)（设(She)计(Ji)）predominant axis 供(Gong)设(She)计(Ji)优(You)化(Hua)坐(Zuo)标(Biao)轴(Zhou)table origin 表(Biao)格(Ge)原(Yuan)点(Dian)mirroring 镜(Jing)像(Xiang)drive file 驱(Qu)动(Dong)文(Wen)件(Jian)intermediate file 中(Zhong)间(Jian)文(Wen)件(Jian)manufacturing documentation 制(Zhi)造(Zao)文(Wen)件(Jian)queue support database 队(Dui)列(Lie)支(Zhi)撑(Cheng)数(Shu)据(Ju)库(Ku)component positioning 元(Yuan)件(Jian)安(An)置(Zhi)graphics dispaly 图(Tu)形(Xing)显(Xian)示(Shi)scaling factor 比(Bi)例(Li)因(Yin)子(Zi)scan filling 扫(Sao)描(Miao)填(Tian)充(Chong)rectangle filling 矩(Ju)形(Xing)填(Tian)充(Chong)region filling 填(Tian)充(Chong)域(Yu)physical design 实(Shi)体(Ti)设(She)计(Ji)logic design 逻(Luo)辑(Ji)设(She)计(Ji)logic circuit 逻(Luo)辑(Ji)电(Dian)路(Lu)hierarchical design 层(Ceng)次(Ci)设(She)计(Ji)top-down design 自(Zi)顶(Ding)向(Xiang)下(Xia)设(She)计(Ji)bottom-up design 自(Zi)底(Di)向(Xiang)上(Shang)设(She)计(Ji)net 线(Xian)网(Wang)digitzing 数(Shu)字(Zi)化(Hua)design rule checking 设(She)计(Ji)规(Gui)则(Ze)检(Jian)查(Cha)router (CAD) 走(Zou)（布(Bu)）线(Xian)器(Qi)net list 网(Wang)络(Luo)表(Biao)subnet 子(Zi)线(Xian)网(Wang)objective function 目(Mu)标(Biao)函(Han)数(Shu)post design processing (PDP) 设(She)计(Ji)后(Hou)处(Chu)理(Li)interactive drawing design 交(Jiao)互(Hu)式(Shi)制(Zhi)图(Tu)设(She)计(Ji)cost metrix 费(Fei)用(Yong)矩(Ju)阵(Zhen)engineering drawing 工(Gong)程(Cheng)图(Tu)block diagram 方(Fang)块(Kuai)框(Kuang)图(Tu)moze 迷(Mi)宫(Gong)component density 元(Yuan)件(Jian)密(Mi)度(Du)traveling salesman problem 回(Hui)售(Shou)货(Huo)员(Yuan)问(Wen)题(Ti)degrees freedom 自(Zi)由(You)度(Du)out going degree 入(Ru)度(Du)incoming degree 出(Chu)度(Du)manhatton distance 曼(Man)哈(Ha)顿(Dun)距(Ju)离(Li)euclidean distance 欧(Ou)几(Ji)里(Li)德(De)距(Ju)离(Li)network 网(Wang)络(Luo)array 阵(Zhen)列(Lie)segment 段(Duan)logic 逻(Luo)辑(Ji)logic design automation 逻(Luo)辑(Ji)设(She)计(Ji)自(Zi)动(Dong)化(Hua)separated time 分(Fen)线(Xian)separated layer 分(Fen)层(Ceng)definite sequence 定(Ding)顺(Shun)序(Xu)conduction (track) 导(Dao)线(Xian)（通(Tong)道(Dao)）conductor width 导(Dao)线(Xian)（体(Ti)）宽(Kuan)度(Du)conductor spacing 导(Dao)线(Xian)距(Ju)离(Li)conductor layer 导(Dao)线(Xian)层(Ceng)conductor line/space 导(Dao)线(Xian)宽(Kuan)度(Du)/间(Jian)距(Ju)conductor layer No.1 第(Di)一(Yi)导(Dao)线(Xian)层(Ceng)round pad 圆(Yuan)形(Xing)盘(Pan)square pad 方(Fang)形(Xing)盘(Pan)diamond pad 菱(Ling)形(Xing)盘(Pan)oblong pad 长(Chang)方(Fang)形(Xing)焊(Han)盘(Pan)bullet pad 子(Zi)弹(Dan)形(Xing)盘(Pan)teardrop pad 泪(Lei)滴(Di)盘(Pan)snowman pad 雪(Xue)人(Ren)盘(Pan)V-shaped pad V形(Xing)盘(Pan)annular pad 环(Huan)形(Xing)盘(Pan)non-circular pad 非(Fei)圆(Yuan)形(Xing)盘(Pan)isolation pad 隔(Ge)离(Li)盘(Pan)monfunctional pad 非(Fei)功(Gong)能(Neng)连(Lian)接(Jie)盘(Pan)offset land 偏(Pian)置(Zhi)连(Lian)接(Jie)盘(Pan)back-bard land 腹(Fu)（背(Bei)）裸(Luo)盘(Pan)anchoring spaur 盘(Pan)址(Zhi)land pattern 连(Lian)接(Jie)盘(Pan)图(Tu)形(Xing)land grid array 连(Lian)接(Jie)盘(Pan)网(Wang)格(Ge)阵(Zhen)列(Lie)annular ring 孔(Kong)环(Huan)component hole 元(Yuan)件(Jian)孔(Kong)mounting hole 安(An)装(Zhuang)孔(Kong)supported hole 支(Zhi)撑(Cheng)孔(Kong)unsupported hole 非(Fei)支(Zhi)撑(Cheng)孔(Kong)via 导(Dao)通(Tong)孔(Kong)plated through hole (PTH) 镀(Du)通(Tong)孔(Kong)access hole 余(Yu)隙(Xi)孔(Kong)blind via (hole) 盲(Mang)孔(Kong)buried via hole 埋(Mai)孔(Kong)buried blind via 埋(Mai),盲(Mang)孔(Kong)any layer inner via hole 任(Ren)意(Yi)层(Ceng)内(Nei)部(Bu)导(Dao)通(Tong)孔(Kong)all drilled hole 全(Quan)部(Bu)钻(Zuan)孔(Kong)toaling hole 定(Ding)位(Wei)孔(Kong)landless hole 无(Wu)连(Lian)接(Jie)盘(Pan)孔(Kong)interstitial hole 中(Zhong)间(Jian)孔(Kong)landless via hole 无(Wu)连(Lian)接(Jie)盘(Pan)导(Dao)通(Tong)孔(Kong)pilot hole 引(Yin)导(Dao)孔(Kong)terminal clearomee hole 端(Duan)接(Jie)全(Quan)隙(Xi)孔(Kong)dimensioned hole 准(Zhun)尺(Chi)寸(Cun)孔(Kong)via-in-pad 在(Zai)连(Lian)接(Jie)盘(Pan)中(Zhong)导(Dao)通(Tong)孔(Kong)hole location 孔(Kong)位(Wei)hole density 孔(Kong)密(Mi)度(Du)hole pattern 孔(Kong)图(Tu)drill drawing 钻(Zuan)孔(Kong)图(Tu)assembly drawing 装(Zhuang)配(Pei)图(Tu)datum referan 参(Can)考(Kao)基(Ji)准(Zhun)一(Yi)、综(Zong)合(He)词(Ci)汇(Hui)1、印(Yin)制(Zhi)电(Dian)路(Lu)：printed circuit2、印(Yin)制(Zhi)线(Xian)路(Lu)：printed wiring3、印(Yin)制(Zhi)板(Ban)：printed board4、印(Yin)制(Zhi)板(Ban)电(Dian)路(Lu)：printed circuit board (PCB)5、印(Yin)制(Zhi)线(Xian)路(Lu)板(Ban)：printed wiring board(PWB)6、印(Yin)制(Zhi)元(Yuan)件(Jian)：printed component7、印(Yin)制(Zhi)接(Jie)点(Dian)：printed contact8、印(Yin)制(Zhi)板(Ban)装(Zhuang)配(Pei)：printed board assembly9、板(Ban)：board10、单(Dan)面(Mian)印(Yin)制(Zhi)板(Ban)：single-sided printed board(SSB)11、双(Shuang)面(Mian)印(Yin)制(Zhi)板(Ban)：double-sided printed board(DSB)12、多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：mulitlayer printed board(MLB)13、多(Duo)层(Ceng)印(Yin)制(Zhi)电(Dian)路(Lu)板(Ban)：mulitlayer printed circuit board14、多(Duo)层(Ceng)印(Yin)制(Zhi)线(Xian)路(Lu)板(Ban)：mulitlayer prited wiring board15、刚(Gang)性(Xing)印(Yin)制(Zhi)板(Ban)：rigid printed board16、刚(Gang)性(Xing)单(Dan)面(Mian)印(Yin)制(Zhi)板(Ban)：rigid single-sided printed borad17、刚(Gang)性(Xing)双(Shuang)面(Mian)印(Yin)制(Zhi)板(Ban)：rigid double-sided printed borad18、刚(Gang)性(Xing)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：rigid multilayer printed board19、挠(Nao)性(Xing)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：flexible multilayer printed board20、挠(Nao)性(Xing)印(Yin)制(Zhi)板(Ban)：flexible printed board21、挠(Nao)性(Xing)单(Dan)面(Mian)印(Yin)制(Zhi)板(Ban)：flexible single-sided printed board22、挠(Nao)性(Xing)双(Shuang)面(Mian)印(Yin)制(Zhi)板(Ban)：flexible double-sided printed board23、挠(Nao)性(Xing)印(Yin)制(Zhi)电(Dian)路(Lu)：flexible printed circuit (FPC)24、挠(Nao)性(Xing)印(Yin)制(Zhi)线(Xian)路(Lu)：flexible printed wiring25、刚(Gang)性(Xing)印(Yin)制(Zhi)板(Ban)：flex-rigid printed board, rigid-flex printed board26、刚(Gang)性(Xing)双(Shuang)面(Mian)印(Yin)制(Zhi)板(Ban)：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚(Gang)性(Xing)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐(Qi)平(Ping)印(Yin)制(Zhi)板(Ban)：flush printed board29、金(Jin)属(Shu)芯(Xin)印(Yin)制(Zhi)板(Ban)：metal core printed board30、金(Jin)属(Shu)基(Ji)印(Yin)制(Zhi)板(Ban)：metal base printed board31、多(Duo)重(Zhong)布(Bu)线(Xian)印(Yin)制(Zhi)板(Ban)：mulit-wiring printed board32、陶(Tao)瓷(Ci)印(Yin)制(Zhi)板(Ban)：ceramic substrate printed board33、导(Dao)电(Dian)胶(Jiao)印(Yin)制(Zhi)板(Ban)：electroconductive paste printed board34、模(Mo)塑(Su)电(Dian)路(Lu)板(Ban)：molded circuit board35、模(Mo)压(Ya)印(Yin)制(Zhi)板(Ban)：stamped printed wiring board36、顺(Shun)序(Xu)层(Ceng)压(Ya)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：sequentially-laminated mulitlayer37、散(San)线(Xian)印(Yin)制(Zhi)板(Ban)：discrete wiring board38、微(Wei)线(Xian)印(Yin)制(Zhi)板(Ban)：micro wire board39、积(Ji)层(Ceng)印(Yin)制(Zhi)板(Ban)：buile-up printed board40、积(Ji)层(Ceng)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：build-up mulitlayer printed board (BUM)41、积(Ji)层(Ceng)挠(Nao)印(Yin)制(Zhi)板(Ban)：build-up flexible printed board42、表(Biao)面(Mian)层(Ceng)合(He)电(Dian)路(Lu)板(Ban)：surface laminar circuit (SLC)43、埋(Mai)入(Ru)凸(Tu)块(Kuai)连(Lian)印(Yin)制(Zhi)板(Ban)：B2it printed board44、多(Duo)层(Ceng)膜(Mo)基(Ji)板(Ban)：multi-layered film substrate(MFS)45、层(Ceng)间(Jian)全(Quan)内(Nei)导(Dao)通(Tong)多(Duo)层(Ceng)印(Yin)制(Zhi)板(Ban)：ALIVH multilayer printed board46、载(Zai)芯(Xin)片(Pian)板(Ban)：chip on board (COB)47、埋(Mai)电(Dian)阻(Zu)板(Ban)：buried resistance board48、母(Mu)板(Ban)：mother board49、子(Zi)板(Ban)：daughter board50、背(Bei)板(Ban)：backplane51、裸(Luo)板(Ban)：bare board52、键(Jian)盘(Pan)板(Ban)夹(Jia)心(Xin)板(Ban)：copper-invar-copper board53、动(Dong)态(Tai)挠(Nao)性(Xing)板(Ban)：dynamic flex board54、静(Jing)态(Tai)挠(Nao)性(Xing)板(Ban)：static flex board55、可(Ke)断(Duan)拼(Pin)板(Ban)：break-away planel56、电(Dian)缆(Lan)：cable57、挠(Nao)性(Xing)扁(Bian)平(Ping)电(Dian)缆(Lan)：flexible flat cable (FFC)58、薄(Bao)膜(Mo)开(Kai)关(Guan)：membrane switch59、混(Hun)合(He)电(Dian)路(Lu)：hybrid circuit60、厚(Hou)膜(Mo)：thick film61、厚(Hou)膜(Mo)电(Dian)路(Lu)：thick film circuit62、薄(Bao)膜(Mo)：thin film63、薄(Bao)膜(Mo)混(Hun)合(He)电(Dian)路(Lu)：thin film hybrid circuit64、互(Hu)连(Lian)：interconnection65、导(Dao)线(Xian)：conductor trace line66、齐(Qi)平(Ping)导(Dao)线(Xian)：flush conductor67、传(Chuan)输(Shu)线(Xian)：transmission line68、跨(Kua)交(Jiao)：crossover69、板(Ban)边(Bian)插(Cha)头(Tou)：edge-board contact70、增(Zeng)强(Qiang)板(Ban)：stiffener71、基(Ji)底(Di)：substrate72、基(Ji)板(Ban)面(Mian)：real estate73、导(Dao)线(Xian)面(Mian)：conductor side74、元(Yuan)件(Jian)面(Mian)：component side75、焊(Han)接(Jie)面(Mian)：solder side76、印(Yin)制(Zhi)：printing77、网(Wang)格(Ge)：grid78、图(Tu)形(Xing)：pattern79、导(Dao)电(Dian)图(Tu)形(Xing)：conductive pattern80、非(Fei)导(Dao)电(Dian)图(Tu)形(Xing)：non-conductive pattern81、字(Zi)符(Fu)：legend82、标(Biao)志(Zhi)：mark二(Er)、基(Ji)材(Cai)：1、基(Ji)材(Cai)：base material2、层(Ceng)压(Ya)板(Ban)：laminate3、覆(Fu)金(Jin)属(Shu)箔(Bo)基(Ji)材(Cai)：metal-clad bade material4、覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)：copper-clad laminate (CCL)5、单(Dan)面(Mian)覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)：single-sided copper-clad laminate6、双(Shuang)面(Mian)覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)：double-sided copper-clad laminate7、复(Fu)合(He)层(Ceng)压(Ya)板(Ban)：composite laminate8、薄(Bao)层(Ceng)压(Ya)板(Ban)：thin laminate9、金(Jin)属(Shu)芯(Xin)覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban)：metal core copper-clad laminate10、金(Jin)属(Shu)基(Ji)覆(Fu)铜(Tong)层(Ceng)压(Ya)板(Ban)：metal base copper-clad laminate11、挠(Nao)性(Xing)覆(Fu)铜(Tong)箔(Bo)绝(Jue)缘(Yuan)薄(Bao)膜(Mo)：flexible copper-clad dielectric film12、基(Ji)体(Ti)材(Cai)料(Liao)：basis material13、预(Yu)浸(Jin)材(Cai)料(Liao)：prepreg14、粘(Zhan)结(Jie)片(Pian)：bonding sheet15、预(Yu)浸(Jin)粘(Zhan)结(Jie)片(Pian)：preimpregnated bonding sheer16、环(Huan)氧(Yang)玻(Bo)璃(Li)基(Ji)板(Ban)：epoxy glass substrate17、加(Jia)成(Cheng)法(Fa)用(Yong)层(Ceng)压(Ya)板(Ban)：laminate for additive process18、预(Yu)制(Zhi)内(Nei)层(Ceng)覆(Fu)箔(Bo)板(Ban)：mass lamination panel19、内(Nei)层(Ceng)芯(Xin)板(Ban)：core material20、催(Cui)化(Hua)板(Ban)材(Cai)：catalyzed board ,coated catalyzed laminate21、涂(Tu)胶(Jiao)催(Cui)化(Hua)层(Ceng)压(Ya)板(Ban)：adhesive-coated catalyzed laminate22、涂(Tu)胶(Jiao)无(Wu)催(Cui)层(Ceng)压(Ya)板(Ban)：adhesive-coated uncatalyzed laminate23、粘(Zhan)结(Jie)层(Ceng)：bonding layer24、粘(Zhan)结(Jie)膜(Mo)：film adhesive25、涂(Tu)胶(Jiao)粘(Zhan)剂(Ji)绝(Jue)缘(Yuan)薄(Bao)膜(Mo)：adhesive coated dielectric film26、无(Wu)支(Zhi)撑(Cheng)胶(Jiao)粘(Zhan)剂(Ji)膜(Mo)：unsupported adhesive film27、覆(Fu)盖(Gai)层(Ceng)：cover layer (cover lay)28、增(Zeng)强(Qiang)板(Ban)材(Cai)：stiffener material29、铜(Tong)箔(Bo)面(Mian)：copper-clad surface30、去(Qu)铜(Tong)箔(Bo)面(Mian)：foil removal surface31、层(Ceng)压(Ya)板(Ban)面(Mian)：unclad laminate surface32、基(Ji)膜(Mo)面(Mian)：base film surface33、胶(Jiao)粘(Zhan)剂(Ji)面(Mian)：adhesive faec34、原(Yuan)始(Shi)光(Guang)洁(Jie)面(Mian)：plate finish35、粗(Cu)面(Mian)：matt finish36、纵(Zong)向(Xiang)：length wise direction37、模(Mo)向(Xiang)：cross wise direction38、剪(Jian)切(Qie)板(Ban)：cut to size panel39、酚(Fen)醛(Quan)纸(Zhi)质(Zhi)覆(Fu)铜(Tong)箔(Bo)板(Ban)：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环(Huan)氧(Yang)纸(Zhi)质(Zhi)覆(Fu)铜(Tong)箔(Bo)板(Ban)：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环(Huan)氧(Yang)玻(Bo)璃(Li)布(Bu)基(Ji)覆(Fu)铜(Tong)箔(Bo)板(Ban)：epoxide woven glass fabric copper-clad laminates42、环(Huan)氧(Yang)玻(Bo)璃(Li)布(Bu)纸(Zhi)复(Fu)合(He)覆(Fu)铜(Tong)箔(Bo)板(Ban)：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环(Huan)氧(Yang)玻(Bo)璃(Li)布(Bu)玻(Bo)璃(Li)纤(Xian)维(Wei)复(Fu)合(He)覆(Fu)铜(Tong)箔(Bo)板(Ban)：epoxide non woven/woven glass reinforced copper-clad laminates44、聚(Ju)酯(Zuo)玻(Bo)璃(Li)布(Bu)覆(Fu)铜(Tong)箔(Bo)板(Ban)：ployester woven glass fabric copper-clad laminates45、聚(Ju)酰(Zuo)亚(Ya)胺(An)玻(Bo)璃(Li)布(Bu)覆(Fu)铜(Tong)箔(Bo)板(Ban)：polyimide woven glass fabric copper-cladlaminates46、双(Shuang)马(Ma)来(Lai)酰(Zuo)亚(Ya)胺(An)三(San)嗪(Zuo)环(Huan)氧(Yang)玻(Bo)璃(Li)布(Bu)覆(Fu)铜(Tong)箔(Bo)板(Ban)：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环(Huan)氧(Yang)合(He)成(Cheng)纤(Xian)维(Wei)布(Bu)覆(Fu)铜(Tong)箔(Bo)板(Ban)：epoxide synthetic fiber fabric copper-clad laminates48、聚(Ju)四(Si)乙(Yi)烯(Xi)玻(Bo)璃(Li)纤(Xian)维(Wei)覆(Fu)铜(Tong)箔(Bo)板(Ban)：teflon/fiber glass copper-clad laminates49、超(Chao)薄(Bao)型(Xing)层(Ceng)压(Ya)板(Ban)：ultra thin laminate50、陶(Tao)瓷(Ci)基(Ji)覆(Fu)铜(Tong)箔(Bo)板(Ban)：ceramics base copper-clad laminates51、紫(Zi)外(Wai)线(Xian)阻(Zu)挡(Dang)型(Xing)覆(Fu)铜(Tong)箔(Bo)板(Ban)：UV blocking copper-clad laminates三(San)、基(Ji)材(Cai)的(De)材(Cai)料(Liao)1、A 阶(Jie)树(Shu)脂(Zhi)：A-stage resin2、B 阶(Jie)树(Shu)脂(Zhi)：B-stage resin3、C 阶(Jie)树(Shu)脂(Zhi)：C-stage resin4、环(Huan)氧(Yang)树(Shu)脂(Zhi)：epoxy resin5、酚(Fen)醛(Quan)树(Shu)脂(Zhi)：phenolic resin6、聚(Ju)酯(Zuo)树(Shu)脂(Zhi)：polyester resin7、聚(Ju)酰(Zuo)亚(Ya)胺(An)树(Shu)脂(Zhi)：polyimide resin8、双(Shuang)马(Ma)来(Lai)酰(Zuo)亚(Ya)胺(An)三(San)嗪(Zuo)树(Shu)脂(Zhi)：bismaleimide-triazine resin9、丙(Bing)烯(Xi)酸(Suan)树(Shu)脂(Zhi)：acrylic resin10、三(San)聚(Ju)氰(Qing)胺(An)甲(Jia)醛(Quan)树(Shu)脂(Zhi)：melamine formaldehyde resin11、多(Duo)官(Guan)能(Neng)环(Huan)氧(Yang)树(Shu)脂(Zhi)：polyfunctional epoxy resin12、溴(Zuo)化(Hua)环(Huan)氧(Yang)树(Shu)脂(Zhi)：brominated epoxy resin13、环(Huan)氧(Yang)酚(Fen)醛(Quan)：epoxy novolac14、氟(Fu)树(Shu)脂(Zhi)：fluroresin15、硅(Gui)树(Shu)脂(Zhi)：silicone resin16、硅(Gui)烷(Wan)：silane17、聚(Ju)合(He)物(Wu)：polymer18、无(Wu)定(Ding)形(Xing)聚(Ju)合(He)物(Wu)：amorphous polymer19、结(Jie)晶(Jing)现(Xian)象(Xiang)：crystalline polamer20、双(Shuang)晶(Jing)现(Xian)象(Xiang)：dimorphism21、共(Gong)聚(Ju)物(Wu)：copolymer22、合(He)成(Cheng)树(Shu)脂(Zhi)：synthetic23、热(Re)固(Gu)性(Xing)树(Shu)脂(Zhi)：thermosetting resin24、热(Re)塑(Su)性(Xing)树(Shu)脂(Zhi)：thermoplastic resin25、感(Gan)光(Guang)性(Xing)树(Shu)脂(Zhi)：photosensitive resin26、环(Huan)氧(Yang)当(Dang)量(Liang)：weight per epoxy equivalent (WPE)27、环(Huan)氧(Yang)值(Zhi)：epoxy value28、双(Shuang)氰(Qing)胺(An)：dicyandiamide29、粘(Zhan)结(Jie)剂(Ji)：binder30、胶(Jiao)粘(Zhan)剂(Ji)：adesive31、固(Gu)化(Hua)剂(Ji)：curing agent32、阻(Zu)燃(Ran)剂(Ji)：flame retardant33、遮(Zhe)光(Guang)剂(Ji)：opaquer34、增(Zeng)塑(Su)剂(Ji)：plasticizers35、不(Bu)饱(Bao)和(He)聚(Ju)酯(Zuo)：unsatuiated polyester36、聚(Ju)酯(Zuo)薄(Bao)膜(Mo)：polyester37、聚(Ju)酰(Zuo)亚(Ya)胺(An)薄(Bao)膜(Mo)：polyimide film (PI)38、聚(Ju)四(Si)氟(Fu)乙(Yi)烯(Xi)：polytetrafluoetylene (PTFE)39、聚(Ju)全(Quan)氟(Fu)乙(Yi)烯(Xi)丙(Bing)烯(Xi)薄(Bao)膜(Mo)：perfluorinated ethylene-propylene copolymer film(FEP)40、增(Zeng)强(Qiang)材(Cai)料(Liao)：reinforcing material41、玻(Bo)璃(Li)纤(Xian)维(Wei)：glass fiber42、E 玻(Bo)璃(Li)纤(Xian)维(Wei)：E-glass fibre43、D 玻(Bo)璃(Li)纤(Xian)维(Wei)：D-glass fibre44、S 玻(Bo)璃(Li)纤(Xian)维(Wei)：S-glass fibre45、玻(Bo)璃(Li)布(Bu)：glass fabric46、非(Fei)织(Zhi)布(Bu)：non-woven fabric47、玻(Bo)璃(Li)纤(Xian)维(Wei)垫(Dian)：glass mats48、纱(Sha)线(Xian)：yarn49、单(Dan)丝(Si)：filament50、绞(Jiao)股(Gu)：strand51、纬(Wei)纱(Sha)：weft yarn52、经(Jing)纱(Sha)：warp yarn53、但(Dan)尼(Ni)尔(Er)：denier54、经(Jing)向(Xiang)：warp-wise55、纬(Wei)向(Xiang)：weft-wise, filling-wise56、织(Zhi)物(Wu)经(Jing)纬(Wei)密(Mi)度(Du)：thread count57、织(Zhi)物(Wu)组(Zu)织(Zhi)：weave structure58、平(Ping)纹(Wen)组(Zu)织(Zhi)：plain structure59、坏(Huai)布(Bu)：grey fabric60、稀(Xi)松(Song)织(Zhi)物(Wu)：woven scrim61、弓(Gong)纬(Wei)：bow of weave62、断(Duan)经(Jing)：end missing63、缺(Que)纬(Wei)：mis-picks64、纬(Wei)斜(Xie)：bias65、折(Zhe)痕(Hen)：crease66、云(Yun)织(Zhi)：waviness67、鱼(Yu)眼(Yan)：fish eye68、毛(Mao)圈(Quan)长(Chang)：feather length69、厚(Hou)薄(Bao)段(Duan)：mark70、裂(Lie)缝(Feng)：split71、捻(Nian)度(Du)：twist of yarn72、浸(Jin)润(Run)剂(Ji)含(Han)量(Liang)：size content73、浸(Jin)润(Run)剂(Ji)残(Can)留(Liu)量(Liang)：size residue74、处(Chu)理(Li)剂(Ji)含(Han)量(Liang)：finish level75、浸(Jin)润(Run)剂(Ji)：size76、偶(Ou)联(Lian)剂(Ji)：couplint agent77、处(Chu)理(Li)织(Zhi)物(Wu)：finished fabric78、聚(Ju)酰(Zuo)胺(An)纤(Xian)维(Wei)：polyarmide fiber79、聚(Ju)酯(Zuo)纤(Xian)维(Wei)非(Fei)织(Zhi)布(Bu)：non-woven polyester fabric80、浸(Jin)渍(Zi)绝(Jue)缘(Yuan)纵(Zong)纸(Zhi)：impregnating insulation paper81、聚(Ju)芳(Fang)酰(Zuo)胺(An)纤(Xian)维(Wei)纸(Zhi)：aromatic polyamide paper82、断(Duan)裂(Lie)长(Chang)：breaking length83、吸(Xi)水(Shui)高(Gao)度(Du)：height of capillary rise84、湿(Shi)强(Qiang)度(Du)保(Bao)留(Liu)率(Lv)：wet strength retention85、白(Bai)度(Du)：whitenness86、陶(Tao)瓷(Ci)：ceramics87、导(Dao)电(Dian)箔(Bo)：conductive foil88、铜(Tong)箔(Bo)：copper foil89、电(Dian)解(Jie)铜(Tong)箔(Bo)：electrodeposited copper foil (ED copper foil)90、压(Ya)延(Yan)铜(Tong)箔(Bo)：rolled copper foil91、退(Tui)火(Huo)铜(Tong)箔(Bo)：annealed copper foil92、压(Ya)延(Yan)退(Tui)火(Huo)铜(Tong)箔(Bo)：rolled annealed copper foil (RA copper foil)93、薄(Bao)铜(Tong)箔(Bo)：thin copper foil94、涂(Tu)胶(Jiao)铜(Tong)箔(Bo)：adhesive coated foil95、涂(Tu)胶(Jiao)脂(Zhi)铜(Tong)箔(Bo)：resin coated copper foil (RCC)96、复(Fu)合(He)金(Jin)属(Shu)箔(Bo)：composite metallic material97、载(Zai)体(Ti)箔(Bo)：carrier foil98、殷(Yin)瓦(Wa)：invar99、箔(Bo)（剖(Po)面(Mian)）轮(Lun)廓(Kuo)：foil profile100、光(Guang)面(Mian)：shiny side101、粗(Cu)糙(Cao)面(Mian)：matte side102、处(Chu)理(Li)面(Mian)：treated side103、防(Fang)锈(Xiu)处(Chu)理(Li)：stain proofing104、双(Shuang)面(Mian)处(Chu)理(Li)铜(Tong)箔(Bo)：double treated foil四(Si)、设(She)计(Ji)1、原(Yuan)理(Li)图(Tu)：shematic diagram2、逻(Luo)辑(Ji)图(Tu)：logic diagram3、印(Yin)制(Zhi)线(Xian)路(Lu)布(Bu)设(She)：printed wire layout4、布(Bu)设(She)总(Zong)图(Tu)：master drawing5、可(Ke)制(Zhi)造(Zao)性(Xing)设(She)计(Ji)：design-for-manufacturability6、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)设(She)计(Ji)：computer-aided design.(CAD)7、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)制(Zhi)造(Zao)：computer-aided manufacturing.(CAM)8、计(Ji)算(Suan)机(Ji)集(Ji)成(Cheng)制(Zhi)造(Zao)：computer integrat manufacturing.(CIM)9、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)工(Gong)程(Cheng)：computer-aided engineering.(CAE)10、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)测(Ce)试(Shi)：computer-aided test.(CAT)11、电(Dian)子(Zi)设(She)计(Ji)自(Zi)动(Dong)化(Hua)：electric design automation .(EDA)12、工(Gong)程(Cheng)设(She)计(Ji)自(Zi)动(Dong)化(Hua)：engineering design automaton .(EDA2)13、组(Zu)装(Zhuang)设(She)计(Ji)自(Zi)动(Dong)化(Hua)：assembly aided architectural design. (AAAD)14、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)制(Zhi)图(Tu)：computer aided drawing15、计(Ji)算(Suan)机(Ji)控(Kong)制(Zhi)显(Xian)示(Shi)：computer controlled display .(CCD)16、布(Bu)局(Ju)：placement17、布(Bu)线(Xian)：routing18、布(Bu)图(Tu)设(She)计(Ji)：layout19、重(Zhong)布(Bu)：rerouting20、模(Mo)拟(Ni)：simulation21、逻(Luo)辑(Ji)模(Mo)拟(Ni)：logic simulation22、电(Dian)路(Lu)模(Mo)拟(Ni)：circit simulation23、时(Shi)序(Xu)模(Mo)拟(Ni)：timing simulation24、模(Mo)块(Kuai)化(Hua)：modularization25、布(Bu)线(Xian)完(Wan)成(Cheng)率(Lv)：layout effeciency26、机(Ji)器(Qi)描(Miao)述(Shu)格(Ge)式(Shi)：machine descriptionm format .(MDF)27、机(Ji)器(Qi)描(Miao)述(Shu)格(Ge)式(Shi)数(Shu)据(Ju)库(Ku)：MDF databse28、设(She)计(Ji)数(Shu)据(Ju)库(Ku)：design database29、设(She)计(Ji)原(Yuan)点(Dian)：design origin30、优(You)化(Hua)（设(She)计(Ji)）：optimization (design)31、供(Gong)设(She)计(Ji)优(You)化(Hua)坐(Zuo)标(Biao)轴(Zhou)：predominant axis32、表(Biao)格(Ge)原(Yuan)点(Dian)：table origin33、镜(Jing)像(Xiang)：mirroring34、驱(Qu)动(Dong)文(Wen)件(Jian)：drive file35、中(Zhong)间(Jian)文(Wen)件(Jian)：intermediate file36、制(Zhi)造(Zao)文(Wen)件(Jian)：manufacturing documentation37、队(Dui)列(Lie)支(Zhi)撑(Cheng)数(Shu)据(Ju)库(Ku)：queue support database38、元(Yuan)件(Jian)安(An)置(Zhi)：component positioning39、图(Tu)形(Xing)显(Xian)示(Shi)：graphics dispaly40、比(Bi)例(Li)因(Yin)子(Zi)：scaling factor41、扫(Sao)描(Miao)填(Tian)充(Chong)：scan filling42、矩(Ju)形(Xing)填(Tian)充(Chong)：rectangle filling43、填(Tian)充(Chong)域(Yu)：region filling44、实(Shi)体(Ti)设(She)计(Ji)：physical design45、逻(Luo)辑(Ji)设(She)计(Ji)：logic design46、逻(Luo)辑(Ji)电(Dian)路(Lu)：logic circuit47、层(Ceng)次(Ci)设(She)计(Ji)：hierarchical design48、自(Zi)顶(Ding)向(Xiang)下(Xia)设(She)计(Ji)：top-down design49、自(Zi)底(Di)向(Xiang)上(Shang)设(She)计(Ji)：bottom-up design50、线(Xian)网(Wang)：net51、数(Shu)字(Zi)化(Hua)：digitzing52、设(She)计(Ji)规(Gui)则(Ze)检(Jian)查(Cha)：design rule checking53、走(Zou)（布(Bu)）线(Xian)器(Qi)：router (CAD)54、网(Wang)络(Luo)表(Biao)：net list55、计(Ji)算(Suan)机(Ji)辅(Fu)助(Zhu)电(Dian)路(Lu)分(Fen)析(Xi)：computer-aided circuit analysis56、子(Zi)线(Xian)网(Wang)：subnet57、目(Mu)标(Biao)函(Han)数(Shu)：objective function58、设(She)计(Ji)后(Hou)处(Chu)理(Li)：post design processing (PDP)59、交(Jiao)互(Hu)式(Shi)制(Zhi)图(Tu)设(She)计(Ji)：interactive drawing design60、费(Fei)用(Yong)矩(Ju)阵(Zhen)：cost metrix61、工(Gong)程(Cheng)图(Tu)：engineering drawing62、方(Fang)块(Kuai)框(Kuang)图(Tu)：block diagram63、迷(Mi)宫(Gong)：moze64、元(Yuan)件(Jian)密(Mi)度(Du)：component density65、巡(Xun)回(Hui)售(Shou)货(Huo)员(Yuan)问(Wen)题(Ti)：traveling salesman problem66、自(Zi)由(You)度(Du)：degrees freedom67、入(Ru)度(Du)：out going degree68、出(Chu)度(Du)：incoming degree69、曼(Man)哈(Ha)顿(Dun)距(Ju)离(Li)：manhatton distance70、欧(Ou)几(Ji)里(Li)德(De)距(Ju)离(Li)：euclidean distance71、网(Wang)络(Luo)：network72、阵(Zhen)列(Lie)：array73、段(Duan)：segment74、逻(Luo)辑(Ji)：logic75、逻(Luo)辑(Ji)设(She)计(Ji)自(Zi)动(Dong)化(Hua)：logic design automation76、分(Fen)线(Xian)：separated time77、分(Fen)层(Ceng)：separated layer78、定(Ding)顺(Shun)序(Xu)：definite sequence五(Wu)、形(Xing)状(Zhuang)与(Yu)尺(Chi)寸(Cun)：1、导(Dao)线(Xian)（通(Tong)道(Dao)）：conduction (track)2、导(Dao)线(Xian)（体(Ti)）宽(Kuan)度(Du)：conductor width3、导(Dao)线(Xian)距(Ju)离(Li)：conductor spacing4、导(Dao)线(Xian)层(Ceng)：conductor layer5、导(Dao)线(Xian)宽(Kuan)度(Du)/间(Jian)距(Ju)：conductor line/space6、第(Di)一(Yi)导(Dao)线(Xian)层(Ceng)：conductor layer No.17、圆(Yuan)形(Xing)盘(Pan)：round pad8、方(Fang)形(Xing)盘(Pan)：square pad9、菱(Ling)形(Xing)盘(Pan)：diamond pad10、长(Chang)方(Fang)形(Xing)焊(Han)盘(Pan)：oblong pad11、子(Zi)弹(Dan)形(Xing)盘(Pan)：bullet pad12、泪(Lei)滴(Di)盘(Pan)：teardrop pad13、雪(Xue)人(Ren)盘(Pan)：snowman pad14、V 形(Xing)盘(Pan)：V-shaped pad15、环(Huan)形(Xing)盘(Pan)：annular pad16、非(Fei)圆(Yuan)形(Xing)盘(Pan)：non-circular pad17、隔(Ge)离(Li)盘(Pan)：isolation pad18、非(Fei)功(Gong)能(Neng)连(Lian)接(Jie)盘(Pan)：monfunctional pad19、偏(Pian)置(Zhi)连(Lian)接(Jie)盘(Pan)：offset land20、腹(Fu)（背(Bei)）裸(Luo)盘(Pan)：back-bard land21、盘(Pan)址(Zhi)：anchoring spaur22、连(Lian)接(Jie)盘(Pan)图(Tu)形(Xing)：land pattern23、连(Lian)接(Jie)盘(Pan)网(Wang)格(Ge)阵(Zhen)列(Lie)：land grid array24、孔(Kong)环(Huan)：annular ring25、元(Yuan)件(Jian)孔(Kong)：component hole26、安(An)装(Zhuang)孔(Kong)：mounting hole27、支(Zhi)撑(Cheng)孔(Kong)：supported hole28、非(Fei)支(Zhi)撑(Cheng)孔(Kong)：unsupported hole29、导(Dao)通(Tong)孔(Kong)：via30、镀(Du)通(Tong)孔(Kong)：plated through hole (PTH)31、余(Yu)隙(Xi)孔(Kong)：access hole32、盲(Mang)孔(Kong)：blind via (hole)33、埋(Mai)孔(Kong)：buried via hole34、埋(Mai)/盲(Mang)孔(Kong)：buried /blind via35、任(Ren)意(Yi)层(Ceng)内(Nei)部(Bu)导(Dao)通(Tong)孔(Kong)：any layer inner via hole (ALIVH)36、全(Quan)部(Bu)钻(Zuan)孔(Kong)：all drilled hole37、定(Ding)位(Wei)孔(Kong)：toaling hole38、无(Wu)连(Lian)接(Jie)盘(Pan)孔(Kong)：landless hole39、中(Zhong)间(Jian)孔(Kong)：interstitial hole40、无(Wu)连(Lian)接(Jie)盘(Pan)导(Dao)通(Tong)孔(Kong)：landless via hole41、引(Yin)导(Dao)孔(Kong)：pilot hole42、端(Duan)接(Jie)全(Quan)隙(Xi)孔(Kong)：terminal clearomee hole43、准(Zhun)表(Biao)面(Mian)间(Jian)镀(Du)覆(Fu)孔(Kong)：quasi-interfacing plated-through hole44、准(Zhun)尺(Chi)寸(Cun)孔(Kong)：dimensioned hole45、在(Zai)连(Lian)接(Jie)盘(Pan)中(Zhong)导(Dao)通(Tong)孔(Kong)：via-in-pad46、孔(Kong)位(Wei)：hole location47、孔(Kong)密(Mi)度(Du)：hole density48、孔(Kong)图(Tu)：hole pattern49、钻(Zuan)孔(Kong)图(Tu)：drill drawing50、装(Zhuang)配(Pei)图(Tu)：assembly drawing51、印(Yin)制(Zhi)板(Ban)组(Zu)装(Zhuang)图(Tu)：printed board assembly drawing52、参(Can)考(Kao)基(Ji)准(Zhun)：datum referan
箩颈苍谤颈，飞补苍驳濒耻辞蝉丑补苍驳辫耻驳耻补苍驳肠丑耻濒颈补辞测颈锄耻箩耻肠丑别苍驳蝉丑颈丑辞苍驳辩颈贬5肠丑耻苍诲颈补苍诲辞苍驳产补苍诲别肠别蝉丑颈诲颈别锄丑补辞，虫颈苍肠丑别诲别飞补颈驳耻补苍蹿补苍驳尘颈补苍锄丑别苍诲别蝉丑颈测耻贬5谤补苍测辞耻产补苍产别苍飞补苍辩耻补苍测颈锄丑颈，锄丑颈蝉丑颈肠补颈测辞苍驳濒颈补辞迟别蝉丑耻诲别濒耻苍锄耻辞锄补辞虫颈苍驳，产颈苍驳锄补颈测辞耻丑辞耻测颈锄颈产补苍肠丑耻测辞耻锄丑耻辞尘颈苍驳虫颈补苍诲别办耻补颈尘补苍肠丑辞苍驳箩颈别办辞耻，虫颈补苍蝉丑颈濒颈补辞肠丑别虫颈苍驳诲别蝉丑别苍蹿别苍，尘耻辩颈补苍濒补颈办补苍蝉丑颈测颈办耻补苍箩颈补苍诲补苍诲别测辞耻驳补颈诲颈补苍肠丑别虫颈苍驳，诲补苍驳谤补苍蝉丑颈肠丑别尘颈苍驳虫颈补苍测辞耻产耻迟辞苍驳诲别肠丑别蝉丑别苍辫颈苍箩颈别别谤肠丑别苍驳，测颈苍肠颈办别苍别苍驳丑耻补苍蝉丑颈蝉丑耻补苍驳锄丑耻补苍驳迟补颈，锄耻颈锄丑辞苍驳诲别蝉丑颈肠丑别测别箩颈耻丑耻颈锄丑补苍虫颈补苍肠丑耻测颈虫颈别产耻迟辞苍驳。诲耻辞诲补苍驳顿贬罢肠丑补丑耻苍蝉颈辩耻产补苍，蝉丑颈蝉补苍驳别诲颈补苍箩颈，辩颈补苍尘颈补苍濒颈补苍驳驳别诲颈补苍箩颈诲耻锄补颈顿贬罢产颈补苍蝉耻虫颈补苍驳锄丑辞苍驳，测颈驳别蹿补诲颈补苍，测颈驳别辩耻诲辞苍驳，丑辞耻辩颈补辞测颈驳别诲颈补苍箩颈，锄丑颈蹿耻锄别辩耻诲辞苍驳。
钱(蚕颈补苍)都(顿耻)转(窜丑耻补苍)完(奥补苍)了(尝颈补辞)，他(罢补)也(驰别)不(叠耻)好(贬补辞)意(驰颈)思(厂颈)再(窜补颈)说(厂丑耻辞)自(窜颈)己(闯颈)转(窜丑耻补苍)错(颁耻辞)了(尝颈补辞)，只(窜丑颈)希(齿颈)望(奥补苍驳)亚(驰补)琴(蚕颈苍)别(叠颈别)跟(骋别苍)着(窜丑耻辞)误(奥耻)会(贬耻颈)就(闯颈耻)好(贬补辞)。
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