《步步祯曦》恋北顾 ^第103章^ 最新更新:2021-07-13...
说到它的动力，也是堪比铃木鲍驰的存在，最大功率、最大马力、最大扭矩和鲍驰是一样的，分别是6.9办飞、9.4匹、10牛米。
2025年01月13日，不过自开年之后，年代剧似乎就陷入了沉寂，哪部剧有可能成为下一个爆款担当？
《步步祯曦》恋北顾 ^第103章^ 最新更新:2021-07-13...
面对复杂多变的国际形势易纲担任了稳定市场预期发言人的角色他多次在重大场合发言中反复强调：货币政策稳字当头我们有较大的货币政策调控空间经济韧性一定会不断加强
翟立宏认为，利润持续呈现负增长的原因主要来自于信托业务收入的大幅下滑和投资收益的持续缩水。另外，近年来信托行业正步入创新转型深水区，新旧动能转换阶段系统建设和团队人员配置的成本费用明显上升，也在一定程度上稀释了净利润水平。工厂SMT生产过程不良现象中英文对照原创2021-11-01 10:51·智慧自动化技术1.安装不良其它Other少件Missing Component多件/残件Extra Component on PCBA立碑Tombstoning反向Wrong Orientation错件Wrong Component偏位Shift/Off Pad侧立Side Termination反白Upsidedown浮高Float脚长Lead too long翘脚Lifted Lead脚未出Lead too short未装Bumpermissing Bumper螺丝松动Loose Screw未装螺丝Missing Screw零件脚偏位Part Pin Shift折脚Bent Lead2. 焊 接 不 良其它Other少锡Insufficient Solder空焊No Solder多锡/包焊Excess Solder锡桥Solder Bridge针洞/空洞Pinholes/Void冷焊Cold solder堵孔Solder in PTH锡尖Solder Projections锡裂Fractured Solder爬锡Wicking拒锡Dewetting3. 清 洁 度其它Other锡珠Solder Balls锡渣Solder Splashes助焊剂残留物Flux ResiduesG/F 沾锡Solder on G/FPCB 脏污Contamination on PCB4. P C B其它Other断线Trace open线路短路Trace short分层DelaminationPAD 翘起Lifted PAD板翘Twist Board孔内沾绿油Soldermask in PTHPAD 沾绿油Soldermask on PADVia 孔不通Impedance On ViaPAD 脱落PAD PeelingPAD 氧化PAD Discoloration线路有阻抗Impedance On Trace裸铜Bare Copper气泡BlisterVia 孔沾锡Solder On Via白斑MeaslingVia 孔沾绿油Soldermask On Via丝印不良Defect Silkscreen5. 元 件其它Other组件破损Component Damaged组件功能不良Component Fail高低 PinUneven Pin缺 PinMissing Pin引脚变色Lead DiscolorationG/F 不良G/F defect值偏大Value High值偏小Value Low歪 PinTwisted Pin弯 PinBent Pin组件变形Component Distortion不良现象中英文对照表1.缺件(MISSING PARTS)2.错件(WRONG PARTS)3.多件(EXCESSIVE PARTS)4.短路(SHORT)5.断路(OPEN)6.线短(WIRE SHORT)7.线长(WIRE LONG)8.拐线(WIRE POOR DDRESS)9.冷焊(COLD SOLDER)10.包焊(EXCESS SOLDER)11.空焊(MISSING SOLDER)12.锡尖(SOLDER ICICLE)13.锡渣(SOLDER SPLASH)14.锡裂(SODER CRACK)15.锡洞(PIN HOLE)16.锡球(SOLDER BALL)17.锡桥(SOLDER BRIDGE)18.滑牙(SCREW LOOSE)19.氧化(RUST)20.异物(FOREIGNER MATERIAL)21.溢胶(EXCESSIVE GLUE)22.锡短路(SOLDER BRIDGE)23.锡不足(SOLDER INSUFFICIENT)24.极性反(WRONG POLARITY)25.脚未入(PIN UNSEATED)26.脚未出(PIN UNVISIBLE)27.脚未剪(PIN NO CUT)28.脚未弯(PIN NOT BENT)29.缺盖章(MISSING STAMP)30.缺标签(MISSING LABEL)31.缺序号(MISSING S/N)32.序号错(WRONG S/N)33.标签错(WRONG LABEL)34.标示错(WRONG MARK)35.脚太短(PIN SHORT)36.J1不洁(J1 DIRTY)37.锡凹陷(SOLDER SCOOPED)38.线序错(W/L OF WIRE)39.未测试(NO TEST)40.VR变形(VR DEFORMED)41.PCB翘皮(PCB PEELING)42.PCB弯曲(PCB TWIST)43.零件沾胶(GLUE ON PARTS)44.零件脚长(PARTS PIN LONG)45.浮件(PARTS LIFT)46.零件歪斜(PARTS TILT)47.零件相触(PARTS TOUCH)48.零件变形(PARTS DEFORMED)49.零件损坏(PARTS DAMAGED)50.零件脚脏(PIN DIRTY)51.零件多装(PARTS EXCESS)52.零件沾锡(SOLDER ON PARTS)53.零件偏移(PARTS SHIFT)54.包装错误(WRONG PACKING)56.尺寸错误(DIMENSION WRONG)57.二极管坏(DIODE NG)58.晶体管坏(TRANSISTOR NG)59.振荡器坏(X’TL NG)60.管装错误(TUBES WRONG)61.阻值错误(IMPEDANCE WRONG)62.版本错误(REV WRONG)63.电测不良(TEST FAILURE)64.版本未标(NON REV LEBEL)65.包装损坏(PACKING DAMAGED)66.印章模糊(STAMPS DEFECTIVE)67.标签歪斜(LABEL TILT)68.外箱损坏(CARTON DAMAGED)69.点胶不良(POOR GLUE)70.IC座氧化(SOCKET RUST)71.缺UL标签(MISSING UL LABEL)72.线材不良(WIRE FAILURE)73.零件脚损坏(PIN DAMAGED)74.金手指沾锡(SOLDER ON GOLDEN FINGERS)75.包装文件错(RACKING DOC WRONG)76.包装数量错(PACKING Q’TY WRONG)77.零件未定位(PARTS UNSEATED)78.金手指沾胶(GLUE ON GOLDEN FINGERS)79.垫片安装不良(WASHER UNSEATED)80.线材安装不良(WIRE UNSEATED)81. 立碑(TOMBSTONE)