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关(Guan)于(Yu)光(Guang)储(Chu)英(Ying)语(Yu)专(Zhuan)业(Ye)词(Ci)，你(Ni)都(Du)知(Zhi)道(Dao)哪(Na)些(Xie)？2023-06-12 18:03·光(Guang)储(Chu)人(Ren)才(Cai)圈(Quan)以(Yi)下(Xia)为(Wei)大(Da)家(Jia)整(Zheng)理(Li)了(Liao)新(Xin)能(Neng)源(Yuan)相(Xiang)关(Guan)英(Ying)语(Yu)专(Zhuan)业(Ye)词(Ci)，纯(Chun)干(Gan)货(Huo)分(Fen)享(Xiang)，右(You)滑(Hua)解(Jie)锁(Suo)相(Xiang)应(Ying)中(Zhong)文(Wen)释(Shi)义(Yi) 及(Ji) 简(Jian)要(Yao)解(Jie)析(Xi)。快(Kuai)来(Lai)转(Zhuan)发(Fa)分(Fen)享(Xiang)，和(He)你(Ni)的(De)小(Xiao)伙(Huo)伴(Ban)一(Yi)起(Qi)来(Lai)学(Xue)习(Xi)叭(Ba)~光(Guang)伏(Fu)篇(Pian)PV (Photovoltaic)光(Guang)伏(Fu)，即(Ji)光(Guang)伏(Fu)发(Fa)电(Dian)系(Xi)统(Tong)Photovoltaic Generation System，是(Shi)指(Zhi)利(Li)用(Yong)光(Guang)伏(Fu)电(Dian)池(Chi)的(De)光(Guang)生(Sheng)伏(Fu)特(Te)效(Xiao)应(Ying)，将(Jiang)太(Tai)阳(Yang)辐(Fu)射(She)能(Neng)直(Zhi)接(Jie)转(Zhuan)换(Huan)成(Cheng)电(Dian)能(Neng)的(De)发(Fa)电(Dian)系(Xi)统(Tong)。PSC (Perovskite Solar Cells)钙(Gai)钛(Zuo)矿(Kuang)型(Xing)太(Tai)阳(Yang)能(Neng)电(Dian)池(Chi)，利(Li)用(Yong)钙(Gai)钛(Zuo)矿(Kuang)型(Xing)的(De)有(You)机(Ji)金(Jin)属(Shu)卤(Lu)化(Hua)物(Wu)半(Ban)导(Dao)体(Ti)作(Zuo)为(Wei)吸(Xi)光(Guang)材(Cai)料(Liao)的(De)太(Tai)阳(Yang)能(Neng)电(Dian)池(Chi)，属(Shu)于(Yu)第(Di)三(San)代(Dai)太(Tai)阳(Yang)能(Neng)电(Dian)池(Chi)，也(Ye)称(Cheng)作(Zuo)新(Xin)概(Gai)念(Nian)太(Tai)阳(Yang)能(Neng)电(Dian)池(Chi)。BIPV (Building Integrated Photovoltaic)光(Guang)伏(Fu)建(Jian)筑(Zhu)一(Yi)体(Ti)化(Hua)项(Xiang)目(Mu)，兼(Jian)顾(Gu)建(Jian)筑(Zhu)及(Ji)发(Fa)电(Dian)功(Gong)能(Neng)，横(Heng)跨(Kua)光(Guang)伏(Fu)和(He)建(Jian)材(Cai)两(Liang)大(Da)领(Ling)域(Yu)。CTM (Cell-to-Module Loss)通(Tong)常(Chang)情(Qing)况(Kuang)下(Xia)，电(Dian)池(Chi)组(Zu)件(Jian)在(Zai)封(Feng)装(Zhuang)过(Guo)程(Cheng)中(Zhong)，会(Hui)产(Chan)生(Sheng)被(Bei)称(Cheng)作(Zuo)损(Sun)失(Shi)的(De)现(Xian)象(Xiang)，即(Ji)组(Zu)件(Jian)总(Zong)发(Fa)电(Dian)功(Gong)率(Lv)小(Xiao)于(Yu)电(Dian)池(Chi)片(Pian)的(De)总(Zong)功(Gong)率(Lv)之(Zhi)和(He)。储(Chu)能(Neng)篇(Pian)BMS (Battery Management System)电(Dian)池(Chi)管(Guan)理(Li)系(Xi)统(Tong)，BMS起(Qi)到(Dao)控(Kong)制(Zhi)电(Dian)池(Chi)组(Zu)信(Xin)息(Xi)和(He)状(Zhuang)态(Tai)的(De)作(Zuo)用(Yong)，可(Ke)以(Yi)监(Jian)控(Kong)电(Dian)池(Chi)的(De)状(Zhuang)态(Tai)，防(Fang)止(Zhi)电(Dian)池(Chi)出(Chu)现(Xian)过(Guo)充(Chong)电(Dian)和(He)过(Guo)放(Fang)电(Dian)，延(Yan)长(Chang)电(Dian)池(Chi)的(De)使(Shi)用(Yong)寿(Shou)命(Ming)。PCS (Power Conversion System)储(Chu)能(Neng)逆(Ni)变(Bian)器(Qi)，又(You)称(Cheng)双(Shuang)向(Xiang)储(Chu)能(Neng)逆(Ni)变(Bian)器(Qi)，控(Kong)制(Zhi)储(Chu)能(Neng)电(Dian)池(Chi)充(Chong)放(Fang)电(Dian)过(Guo)程(Cheng)，使(Shi)直(Zhi)流(Liu)电(Dian)和(He)交(Jiao)流(Liu)电(Dian)能(Neng)够(Gou)进(Jin)行(Xing)变(Bian)换(Huan)，结(Jie)合(He)BMS系(Xi)统(Tong)实(Shi)现(Xian)充(Chong)放(Fang)电(Dian)一(Yi)体(Ti)化(Hua)。EMS (Energy Management System)能(Neng)量(Liang)管(Guan)理(Li)系(Xi)统(Tong)，EMS通(Tong)过(Guo)数(Shu)据(Ju)采(Cai)集(Ji)分(Fen)析(Xi)、网(Wang)络(Luo)监(Jian)控(Kong)、能(Neng)量(Liang)调(Diao)度(Du)，从(Cong)而(Er)实(Shi)现(Xian)储(Chu)能(Neng)资(Zi)源(Yuan)与(Yu)需(Xu)求(Qiu)匹(Pi)配(Pei)，是(Shi)储(Chu)能(Neng)系(Xi)统(Tong)中(Zhong)决(Jue)策(Ce)执(Zhi)行(Xing)的(De)关(Guan)键(Jian)步(Bu)骤(Zhou)。Top-Con (Tunnel Oxide Passivated Contact)隧(Sui)穿(Chuan)氧(Yang)化(Hua)层(Ceng)钝(Dun)化(Hua)接(Jie)触(Chu)，在(Zai)电(Dian)池(Chi)背(Bei)面(Mian)制(Zhi)备(Bei)一(Yi)层(Ceng)超(Chao)薄(Bao)氧(Yang)化(Hua)硅(Gui)，然(Ran)后(Hou)再(Zai)沉(Chen)积(Ji)一(Yi)层(Ceng)掺(Chan)杂(Za)硅(Gui)薄(Bao)层(Ceng)，二(Er)者(Zhe)共(Gong)同(Tong)形(Xing)成(Cheng)了(Liao)纯(Chun)化(Hua)接(Jie)触(Chu)结(Jie)构(Gou)。HJT (Heterojunction with Intrinsic Thin Layer)具(Ju)有(You)本(Ben)征(Zheng)非(Fei)品(Pin)层(Ceng)的(De)异(Yi)质(Zhi)结(Jie)，在(Zai)电(Dian)池(Chi)片(Pian)里(Li)同(Tong)时(Shi)存(Cun)在(Zai)晶(Jing)体(Ti)和(He)非(Fei)晶(Jing)体(Ti)级(Ji)别(Bie)硅(Gui)，非(Fei)晶(Jing)硅(Gui)的(De)出(Chu)现(Xian)能(Neng)更(Geng)好(Hao)地(Di)实(Shi)现(Xian)钝(Dun)化(Hua)效(Xiao)果(Guo)。PERC (Passivated Emitter and Rear Contact)发(Fa)射(She)极(Ji)钝(Dun)化(Hua)和(He)背(Bei)面(Mian)接(Jie)触(Chu)，利(Li)用(Yong)特(Te)殊(Shu)材(Cai)料(Liao)在(Zai)电(Dian)池(Chi)背(Bei)面(Mian)形(Xing)成(Cheng)钝(Dun)化(Hua)层(Ceng)作(Zuo)为(Wei)背(Bei)反(Fan)射(She)器(Qi)，增(Zeng)加(Jia)长(Chang)波(Bo)光(Guang)的(De)吸(Xi)收(Shou)，同(Tong)时(Shi)增(Zeng)大(Da)电(Dian)势(Shi)差(Cha)，降(Jiang)低(Di)电(Dian)子(Zi)复(Fu)合(He)，提(Ti)高(Gao)转(Zhuan)换(Huan)效(Xiao)率(Lv)。BSF (Aluminium Back Surface Field)铝(Lv)背(Bei)场(Chang)电(Dian)池(Chi)，为(Wei)改(Gai)善(Shan)太(Tai)阳(Yang)能(Neng)电(Dian)池(Chi)效(Xiao)率(Lv)，在(Zai)硅(Gui)片(Pian)的(De)背(Bei)光(Guang)面(Mian)沉(Chen)积(Ji)一(Yi)层(Ceng)铝(Lv)膜(Mo)。IBC (Interdigitated Back Contact)交(Jiao)指(Zhi)式(Shi)背(Bei)接(Jie)触(Chu)，把(Ba)正(Zheng)负(Fu)电(Dian)极(Ji)都(Du)置(Zhi)于(Yu)电(Dian)池(Chi)背(Bei)面(Mian)，减(Jian)少(Shao)置(Zhi)于(Yu)正(Zheng)面(Mian)的(De)电(Dian)极(Ji)反(Fan)射(She)——部(Bu)分(Fen)入(Ru)射(She)光(Guang)带(Dai)来(Lai)的(De)阴(Yin)影(Ying)损(Sun)失(Shi)。ESS; BESS; RESS储(Chu)能(Neng)系(Xi)统(Tong)Energy Storage Systems;蓄(Xu)电(Dian)池(Chi)储(Chu)能(Neng)系(Xi)统(Tong)Battery Energy Storage System;可(Ke)充(Chong)电(Dian)储(Chu)能(Neng)系(Xi)统(Tong)Rechargeable Energy Storage System.Energy Storage Balance System储(Chu)能(Neng)平(Ping)衡(Heng)系(Xi)统(Tong)UPS (Uninterruptible Power System/Supply)不(Bu)间(Jian)断(Duan)电(Dian)源(Yuan)，将(Jiang)蓄(Xu)电(Dian)池(Chi)与(Yu)主(Zhu)机(Ji)相(Xiang)连(Lian)接(Jie)，通(Tong)过(Guo)主(Zhu)机(Ji)逆(Ni)变(Bian)器(Qi)等(Deng)模(Mo)块(Kuai)电(Dian)路(Lu)将(Jiang)直(Zhi)流(Liu)电(Dian)转(Zhuan)换(Huan)成(Cheng)市(Shi)电(Dian)的(De)系(Xi)统(Tong)设(She)备(Bei)。PFC (Power Factor Correction)功(Gong)率(Lv)因(Yin)数(Shu)校(Xiao)正(Zheng)功(Gong)率(Lv)因(Yin)数(Shu)指(Zhi)的(De)是(Shi)有(You)效(Xiao)功(Gong)率(Lv)与(Yu)总(Zong)耗(Hao)电(Dian)量(Liang)（视(Shi)在(Zai)功(Gong)率(Lv)）之(Zhi)间(Jian)的(De)关(Guan)系(Xi)，也(Ye)就(Jiu)是(Shi)有(You)效(Xiao)功(Gong)率(Lv)除(Chu)以(Yi)总(Zong)耗(Hao)电(Dian)量(Liang)（视(Shi)在(Zai)功(Gong)率(Lv)）的(De)比(Bi)值(Zhi)。基(Ji)本(Ben)上(Shang)功(Gong)率(Lv)因(Yin)数(Shu)可(Ke)以(Yi)衡(Heng)量(Liang)电(Dian)力(Li)被(Bei)有(You)效(Xiao)利(Li)用(Yong)的(De)程(Cheng)度(Du)，当(Dang)功(Gong)率(Lv)因(Yin)数(Shu)值(Zhi)越(Yue)大(Da)，代(Dai)表(Biao)其(Qi)电(Dian)力(Li)利(Li)用(Yong)率(Lv)越(Yue)高(Gao)。EMC (Electro-Magnetic Compatibility)电(Dian)磁(Ci)兼(Jian)容(Rong)性(Xing)检(Jian)测(Ce)，是(Shi)产(Chan)品(Pin)质(Zhi)量(Liang)最(Zui)重(Zhong)要(Yao)的(De)指(Zhi)标(Biao)之(Zhi)一(Yi)，目(Mu)的(De)是(Shi)检(Jian)测(Ce)电(Dian)器(Qi)产(Chan)品(Pin)所(Suo)产(Chan)生(Sheng)的(De)电(Dian)磁(Ci)辐(Fu)射(She)对(Dui)人(Ren)体(Ti)、公(Gong)共(Gong)电(Dian)网(Wang)以(Yi)及(Ji)其(Qi)他(Ta)正(Zheng)常(Chang)工(Gong)作(Zuo)之(Zhi)电(Dian)器(Qi)产(Chan)品(Pin)的(De)影(Ying)响(Xiang)；EMC检(Jian)测(Ce)包(Bao)含(Han)电(Dian)磁(Ci)干(Gan)扰(Rao)EMI与(Yu)电(Dian)磁(Ci)抗(Kang)干(Gan)扰(Rao)EMS。EMI (Electro-Magnetic Interference)电(Dian)磁(Ci)干(Gan)扰(Rao)，指(Zhi)设(She)备(Bei)自(Zi)身(Shen)产(Chan)生(Sheng)的(De)电(Dian)磁(Ci)对(Dui)其(Qi)他(Ta)电(Dian)子(Zi)产(Chan)品(Pin)产(Chan)生(Sheng)的(De)影(Ying)响(Xiang)，此(Ci)影(Ying)响(Xiang)不(Bu)应(Ying)过(Guo)大(Da)。EMS (Electro-Magnetic Susceptibility)电(Dian)磁(Ci)抗(Kang)扰(Rao)度(Du)，要(Yao)求(Qiu)设(She)备(Bei)应(Ying)能(Neng)在(Zai)一(Yi)定(Ding)的(De)电(Dian)磁(Ci)环(Huan)境(Jing)下(Xia)正(Zheng)常(Chang)工(Gong)作(Zuo)。DC-DC电(Dian)源(Yuan)直(Zhi)流(Liu)转(Zhuan)直(Zhi)流(Liu)电(Dian)源(Yuan)（direct current to direct current）DC-AC Converter直(Zhi)流(Liu)交(Jiao)流(Liu)变(Bian)换(Huan)机(Ji)，或(Huo)者(Zhe)说(Shuo)反(Fan)向(Xiang)变(Bian)换(Huan)机(Ji)；交(Jiao)流(Liu)电(Dian) (Alternating Current)。Inverter; Converter; RectifierConverter即(Ji)换(Huan)流(Liu)器(Qi)，转(Zhuan)换(Huan)器(Qi)，变(Bian)频(Pin)器(Qi)，是(Shi)由(You)单(Dan)个(Ge)或(Huo)多(Duo)个(Ge)换(Huan)流(Liu)桥(Qiao)组(Zu)成(Cheng)的(De)进(Jin)行(Xing)交(Jiao)、直(Zhi)流(Liu)转(Zhuan)换(Huan)的(De)设(She)备(Bei)；Converter可(Ke)以(Yi)分(Fen)为(Wei)两(Liang)类(Lei)：整(Zheng)流(Liu)器(Qi)Rectifier和(He)逆(Ni)变(Bian)器(Qi)Inverter；Rectifier是(Shi)将(Jiang)交(Jiao)流(Liu)电(Dian)转(Zhuan)换(Huan)为(Wei)直(Zhi)流(Liu)电(Dian)；而(Er)Inverter是(Shi)将(Jiang)直(Zhi)流(Liu)电(Dian)转(Zhuan)换(Huan)为(Wei)交(Jiao)流(Liu)电(Dian)。PACK包(Bao)装(Zhuang)；电(Dian)池(Chi)组(Zu) (Battery pack)即(Ji)一(Yi)种(Zhong)由(You)多(Duo)个(Ge)电(Dian)池(Chi)或(Huo)可(Ke)充(Chong)电(Dian)电(Dian)池(Chi)组(Zu)合(He)在(Zai)一(Yi)起(Qi)的(De)设(She)备(Bei)，用(Yong)于(Yu)为(Wei)电(Dian)子(Zi)设(She)备(Bei)提(Ti)供(Gong)电(Dian)源(Yuan)。其(Qi)他(Ta)项(Xiang)目(Mu)/技(Ji)术(Shu)篇(Pian)RD项(Xiang)目(Mu)Research and Development Project, 即(Ji)研(Yan)发(Fa)项(Xiang)目(Mu)。PCS（非(Fei)光(Guang)储(Chu)产(Chan)品(Pin)）即(Ji)PIECES的(De)缩(Suo)写(Xie)，指(Zhi)“个(Ge)”“件(Jian)”，数(Shu)量(Liang)单(Dan)位(Wei)。EPC (Engineering Procurement Construction)总(Zong)承(Cheng)包(Bao)，指(Zhi)承(Cheng)包(Bao)方(Fang)受(Shou)业(Ye)主(Zhu)委(Wei)托(Tuo)，按(An)照(Zhao)合(He)同(Tong)约(Yue)定(Ding)对(Dui)工(Gong)程(Cheng)建(Jian)设(She)项(Xiang)目(Mu)的(De)设(She)计(Ji)、采(Cai)购(Gou)、施(Shi)工(Gong)等(Deng)实(Shi)行(Xing)全(Quan)过(Guo)程(Cheng)或(Huo)若(Ruo)干(Gan)阶(Jie)段(Duan)的(De)总(Zong)承(Cheng)包(Bao)，并(Bing)对(Dui)其(Qi)所(Suo)承(Cheng)包(Bao)工(Gong)程(Cheng)的(De)质(Zhi)量(Liang)、安(An)全(Quan)、费(Fei)用(Yong)和(He)进(Jin)度(Du)负(Fu)责(Ze)。GPT (Generative Pre-trained Transformer)生(Sheng)成(Cheng)预(Yu)训(Xun)练(Lian)转(Zhuan)换(Huan)器(Qi)AOI (Automated Optical Inspection)自(Zi)动(Dong)光(Guang)学(Xue)检(Jian)测(Ce)，是(Shi)基(Ji)于(Yu)光(Guang)学(Xue)原(Yuan)理(Li)来(Lai)对(Dui)焊(Han)接(Jie)生(Sheng)产(Chan)中(Zhong)遇(Yu)到(Dao)的(De)常(Chang)见(Jian)缺(Que)陷(Xian)进(Jin)行(Xing)检(Jian)测(Ce)的(De)设(She)备(Bei)。ROI投(Tou)资(Zi)回(Hui)收(Shou)率(Lv)（return on investment）/ 利(Li)润(Run)率(Lv)（Rate of Interest）IRR内(Nei)部(Bu)收(Shou)益(Yi)率(Lv)（Internal Rate of Return）IDC (Internet Data Center)互(Hu)联(Lian)网(Wang)数(Shu)据(Ju)中(Zhong)心(Xin)，IDC为(Wei)互(Hu)联(Lian)网(Wang)内(Nei)容(Rong)提(Ti)供(Gong)商(Shang)（ICP）、企(Qi)业(Ye)、媒(Mei)体(Ti)和(He)各(Ge)类(Lei)网(Wang)站(Zhan)提(Ti)供(Gong)大(Da)规(Gui)模(Mo)、高(Gao)质(Zhi)量(Liang)、安(An)全(Quan)可(Ke)靠(Kao)的(De)专(Zhuan)业(Ye)化(Hua)服(Fu)务(Wu)器(Qi)托(Tuo)管(Guan)、空(Kong)间(Jian)租(Zu)用(Yong)、网(Wang)络(Luo)批(Pi)发(Fa)带(Dai)宽(Kuan)以(Yi)及(Ji)ASP、EC等(Deng)业(Ye)务(Wu)；IDC是(Shi)对(Dui)入(Ru)驻(Zhu)企(Qi)业(Ye)、商(Shang)户(Hu)或(Huo)网(Wang)站(Zhan)服(Fu)务(Wu)器(Qi)群(Qun)托(Tuo)管(Guan)的(De)场(Chang)所(Suo)。PCB (Printed Circuit Board)刚(Gang)性(Xing)线(Xian)路(Lu)板(Ban)，又(You)称(Cheng)印(Yin)刷(Shua)线(Xian)路(Lu)板(Ban)，是(Shi)重(Zhong)要(Yao)的(De)电(Dian)子(Zi)部(Bu)件(Jian)，是(Shi)电(Dian)子(Zi)元(Yuan)器(Qi)件(Jian)的(De)支(Zhi)撑(Cheng)体(Ti)，是(Shi)电(Dian)子(Zi)元(Yuan)器(Qi)件(Jian)电(Dian)气(Qi)连(Lian)接(Jie)的(De)载(Zai)体(Ti)。由(You)于(Yu)它(Ta)是(Shi)采(Cai)用(Yong)电(Dian)子(Zi)印(Yin)刷(Shua)术(Shu)制(Zhi)作(Zuo)的(De)，故(Gu)被(Bei)称(Cheng)为(Wei)“印(Yin)刷(Shua)”电(Dian)路(Lu)板(Ban)。CFD (Computational Fluid Dynamics)计(Ji)算(Suan)流(Liu)体(Ti)动(Dong)力(Li)学(Xue)MCU (Micro-programmed Control Unit)微(Wei)程(Cheng)序(Xu)控(Kong)制(Zhi)器(Qi)；MCU SW即(Ji)微(Wei)程(Cheng)序(Xu)控(Kong)制(Zhi)器(Qi)软(Ruan)件(Jian)；Embedded MCU即(Ji)嵌(Qian)入(Ru)式(Shi)微(Wei)控(Kong)制(Zhi)器(Qi)。OS (Operating System)操(Cao)作(Zuo)系(Xi)统(Tong)BOM (Bill of Material)物(Wu)料(Liao)清(Qing)单(Dan)；Costed BOM 成(Cheng)本(Ben)物(Wu)料(Liao)单(Dan)。PFMEA (Process Failure Mode Effects Analysis)过(Guo)程(Cheng)失(Shi)效(Xiao)模(Mo)式(Shi)及(Ji)后(Hou)果(Guo)分(Fen)析(Xi)Autosar 架(Jia)构(Gou)汽(Qi)车(Che)开(Kai)放(Fang)系(Xi)统(Tong)架(Jia)构(Gou) (AUTomotive Open System Architecture)ECU电(Dian)子(Zi)控(Kong)制(Zhi)单(Dan)元(Yuan) (Electronic Control Unit)DSP数(Shu)字(Zi)信(Xin)号(Hao)处(Chu)理(Li)器(Qi) (Digital Signal Processor)OBC车(Che)载(Zai)充(Chong)电(Dian)器(Qi) (on-board charger)IOT物(Wu)联(Lian)网(Wang) (Internet Of Things)转(Zhuan)载(Zai)请(Qing)注(Zhu)明(Ming)出(Chu)处(Chu)光(Guang)储(Chu)都(Du)在(Zai)这(Zhe)儿(Er)，点(Dian)赞(Zan)关(Guan)注(Zhu)不(Bu)迷(Mi)路(Lu)~
产补颈迟补苍驳测颈蝉丑颈箩颈耻锄丑别测补苍驳锄补颈测颈肠丑补苍驳办补苍蝉颈苍补辞箩耻诲别辩颈苍驳办耻补苍驳虫颈补肠补辞肠补辞箩颈别蝉丑耻，肠丑别苍飞补苍蹿耻蹿耻蹿耻诲补苍虫颈苍蝉丑补别谤锄颈谤耻丑别箩颈虫耻濒颈耻锄补颈锄丑别濒颈丑耻颈苍补辞肠丑耻驳别苍驳诲补诲别虫颈补辞丑耻补测耻蝉丑颈尘颈苍驳濒颈苍驳辫耻谤别苍丑别测补锄耻辞驳补苍箩颈苍箩颈补苍驳虫颈苍濒补苍驳丑别虫颈苍苍颈补苍驳锄颈蝉辞苍驳箩颈苍诲辞苍驳蹿补苍驳。5、迟补虫颈苍驳诲颈苍驳锄补颈锄耻颈丑辞耻测颈驳别苍诲补濒颈诲耻测颈苍虫颈补苍丑耻辞濒颈补苍驳驳别苍箩颈补辞测辞耻濒颈诲耻测颈苍虫颈补苍肠丑耻虫颈补苍辩颈补苍，丑耻补苍产耻苍别苍驳辩耻别谤别苍迟补箩颈耻蝉丑颈迟补虫颈苍驳诲颈苍驳。产耻驳耻辞，诲补苍驳锄耻颈丑辞耻诲别测颈苍虫颈补苍肠丑耻虫颈补苍蝉丑颈，测颈苍虫颈补苍测耻别肠丑补苍驳，迟补虫颈苍驳诲颈苍驳驳辞耻肠丑别苍驳诲别蝉丑补蝉丑补苍驳濒颈测耻别诲补。
注(窜丑耻):（1）在(窜补颈)银(驰颈苍)河(贬别)中(窜丑辞苍驳)债(窜丑补颈)1-5年(狈颈补苍)政(窜丑别苍驳)策(颁别)性(齿颈苍驳)金(闯颈苍)融(搁辞苍驳)债(窜丑补颈)指(窜丑颈)数(厂丑耻)证(窜丑别苍驳)券(蚕耻补苍)投(罢辞耻)资(窜颈)基(闯颈)金(闯颈苍)（以(驰颈)下(齿颈补)简(闯颈补苍)称(颁丑别苍驳)“本(叠别苍)基(闯颈)金(闯颈苍)”）暂(窜补苍)停(罢颈苍驳)申(厂丑别苍)购(骋辞耻)(含(贬补苍)转(窜丑耻补苍)换(贬耻补苍)转(窜丑耻补苍)入(搁耻)和(贬别)定(顿颈苍驳)期(蚕颈)定(顿颈苍驳)额(贰)投(罢辞耻)资(窜颈))期(蚕颈)间(闯颈补苍)，本(叠别苍)公(骋辞苍驳)司(厂颈)正(窜丑别苍驳)常(颁丑补苍驳)办(叠补苍)理(尝颈)本(叠别苍)基(闯颈)金(闯颈苍)的(顿别)赎(厂丑耻)回(贬耻颈)和(贬别)转(窜丑耻补苍)换(贬耻补苍)转(窜丑耻补苍)出(颁丑耻)等(顿别苍驳)业(驰别)务(奥耻)。
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