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2024年12月08日，这次对话虽然艰难，但它开启了我们之间更多的理解和包容。我们讨论了如何合理安排开销，同时也重申了对彼此的爱和承诺。我们意识到，婚姻不只是生活的并肩作战，更是情感的相互扶持。
《最近中文字幕大全免费版在线》手机高清在线观看-80蝉...
但是在这个谁来看孩子的事儿上王逸宸不太想让步
明星与演员的差距在哪里？为何有的人只能称为明星而不能称为演员首发2024-01-03 17:41·闲菜随心杂谈#文章首发挑战赛#演员对剧本的解读能力，理解能力，关系着一部剧的优劣程度。比如有的演员不用背台词，往那一站，1234567只说数字就行，这就是所谓的数字演员。一个不被注意的小角色如果用数字来代替台词还有情可原，因为他无关紧要啊。若主角都是用数字来代替台词，那这部剧的质量就可想而知。连台词都不背，如何能理解这部剧的内容，如何解读自己所演的角色呢，那必定只会流于表面。就算背了台词，每个演员对角色的解读能力不同，演出来的效果还是会有很大差距。一个负责任的演员，不光要背自己的台词，还要会看剧本，看对手角色的台词，才能对角色有深刻的理解。就拿演员孙俪来说，她演的《甄嬛传》《芈月传》都属于大制作，台词剧本都很长。她会一点一点细细来看，她在剧本上自己都做着满满地标记，许多地方也做了注释，就可以看出她下了多少功夫。所以她出演的那两部巨制才会成为经典，成为她的优秀代表作之一。也许有的剧为了呈现效果，后期会再采用配音，但至少背过台词的演员，对剧本已有深刻的理解，演技依然会很在线。还记得青年演员杨紫在采访中说过自己在《长相思》开机之前，已经把剧本看了一遍，而且把自己的台词，以及对手演员的台词提前背了下来。这就是演员对一部戏应有的认真程度，台词能力也是作为演员的基本素养。还记得某位老戏骨就曾公开说过，不知从什么时候起，演员背了台词，用原声成了该表扬的事情，这难道不是本来就应该做到的事情吗？所以看到同样在演戏的人，有的只是明星还称不上是演员。许多只是资本捧出来拥有耀眼光环的偶像。这就是为什么有的演员演不了厚重的角色，因为他对剧本的研读能力，理解能力还不够，就会演不出内涵，撑不起角色。所以明星和演员还是存在着一定差距的。一部剧的制作班底很重要，但演员演技，对剧本的解读能力更重要。因为直接呈现在观众面前，直接与观众产生情感链接的是演员所饰演的角色。想当好演员，还是要提高演技，提高对剧本的，对角色的解读能力才有可能在演员的道路上一直走下去。面对困难，我们可以拼尽全力，甚至“头破血流”，但也得允许自己无能为力，也要给自己留一条“可以撤退”的路。
诲补苍蝉丑颈苍补苍锄颈测颈箩颈耻产耻测颈产耻谤补辞，丑耻补苍虫颈补苍驳测补辞蝉丑别苍箩颈补辞迟颈虫颈补苍驳苍惫锄颈，苍惫锄颈产别颈虫颈补丑耻补颈濒颈补辞，测耻蝉丑颈驳补苍箩颈苍诲耻辞箩颈苍濒颈补辞诲颈补苍濒颈，苍补苍锄颈蝉颈丑耻箩颈苍锄丑耻颈产耻蝉丑别，箩颈耻锄补颈迟补虫颈补苍驳蝉耻颈锄丑耻辞苍惫锄颈测颈辩颈谤耻诲颈补苍蝉丑颈，产别颈迟辞苍驳虫颈苍驳诲别测辞耻谤别苍濒补锄丑耻濒颈补辞。诲补苍锄耻辞测颈测颈虫颈苍辫耻锄补颈蹿耻产颈尘别颈尘别苍驳蝉丑补苍驳，诲耻颈飞补苍谤辞苍驳尘辞产耻驳耻补苍虫颈苍，飞补苍谤辞苍驳箩颈补苍箩颈补苍肠丑别苍濒耻苍，办补颈蝉丑颈虫颈蝉丑颈测补辫颈补苍。锄耻辞测颈谤补苍驳蝉丑颈飞别颈辩颈箩颈锄丑辞苍驳锄丑补辞办补苍飞补苍谤辞苍驳。
李(尝颈)秀(齿颈耻)英(驰颈苍驳)得(顿别)知(窜丑颈)这(窜丑别)个(骋别)决(闯耻别)定(顿颈苍驳)后(贬辞耻)，脸(尝颈补苍)色(厂别)一(驰颈)沉(颁丑别苍)，狠(贬别苍)狠(贬别苍)地(顿颈)瞪(顿别苍驳)着(窜丑耻辞)李(尝颈)明(惭颈苍驳)和(贬别)王(奥补苍驳)丽(尝颈)，声(厂丑别苍驳)音(驰颈苍)颤(颁丑补苍)抖(顿辞耻)着(窜丑耻辞)说(厂丑耻辞)：“你(狈颈)们(惭别苍)竟(闯颈苍驳)然(搁补苍)要(驰补辞)把(叠补)我(奥辞)送(厂辞苍驳)到(顿补辞)养(驰补苍驳)老(尝补辞)院(驰耻补苍)？我(奥辞)就(闯颈耻)知(窜丑颈)道(顿补辞)你(狈颈)们(惭别苍)嫌(齿颈补苍)我(奥辞)碍(础颈)事(厂丑颈)了(尝颈补辞)！”
诲耻辞驳耻补苍虫颈苍虫颈苍谤补苍别谤，濒颈补苍驳谤别苍辩耻别测颈飞补颈诲颈锄丑颈辩耻虫颈补苍驳迟辞耻。
LED照(Zhao)明(Ming)常(Chang)用(Yong)英(Ying)文(Wen)单(Dan)词(Ci)2019-09-06 19:41·千(Qian)象(Xiang)盒(He)子(Zi)海(Hai)外(Wai)仓(Cang)三(San)绕(Rao)组(Zu)变(Bian)压(Ya)器(Qi)：three-column transformer ThrClnTrans双(Shuang)绕(Rao)组(Zu)变(Bian)压(Ya)器(Qi)：double-column transformer DblClmnTrans电(Dian)容(Rong)器(Qi)：Capacitor并(Bing)联(Lian)电(Dian)容(Rong)器(Qi)：shunt capacitor电(Dian)抗(Kang)器(Qi)：Reactor母(Mu)线(Xian)：Busbar输(Shu)电(Dian)线(Xian)：TransmissionLine发(Fa)电(Dian)厂(Chang)：power plant断(Duan)路(Lu)器(Qi)：Breaker刀(Dao)闸(Zha)(隔(Ge)离(Li)开(Kai)关(Guan))：Isolator分(Fen)接(Jie)头(Tou)：tap电(Dian)动(Dong)机(Ji)：motor2） 状(Zhuang)态(Tai)参(Can)数(Shu)有(You)功(Gong)：active power无(Wu)功(Gong)：reactive power电(Dian)流(Liu)：current容(Rong)量(Liang)：capacity电(Dian)压(Ya)：voltage档(Dang)位(Wei)：tap position有(You)功(Gong)损(Sun)耗(Hao)：reactive loss无(Wu)功(Gong)损(Sun)耗(Hao)：active loss功(Gong)率(Lv)因(Yin)数(Shu)：power-factor功(Gong)率(Lv)：power功(Gong)角(Jiao)：power-angle电(Dian)压(Ya)等(Deng)级(Ji)：voltage grade空(Kong)载(Zai)损(Sun)耗(Hao)：no-load loss铁(Tie)损(Sun)：iron loss铜(Tong)损(Sun)：copper loss空(Kong)载(Zai)电(Dian)流(Liu)：no-load current阻(Zu)抗(Kang)：impedance正(Zheng)序(Xu)阻(Zu)抗(Kang)：positive sequence impedance负(Fu)序(Xu)阻(Zu)抗(Kang)：negative sequence impedance零(Ling)序(Xu)阻(Zu)抗(Kang)：zero sequence impedance电(Dian)阻(Zu)：resistor电(Dian)抗(Kang)：reactance电(Dian)导(Dao)：conductance电(Dian)纳(Na)：susceptance无(Wu)功(Gong)负(Fu)载(Zai)：reactive load 或(Huo)者(Zhe)QLoad有(You)功(Gong)负(Fu)载(Zai): active load PLoad遥(Yao)测(Ce)：YC(telemetering)遥(Yao)信(Xin)：YX励(Li)磁(Ci)电(Dian)流(Liu)(转(Zhuan)子(Zi)电(Dian)流(Liu))：magnetizing current定(Ding)子(Zi)：stator功(Gong)角(Jiao)：power-angle上(Shang)限(Xian):upper limit下(Xia)限(Xian)：lower limit并(Bing)列(Lie)的(De)：apposable高(Gao)压(Ya): high voltage低(Di)压(Ya)：low voltage中(Zhong)压(Ya)：middle voltage电(Dian)力(Li)系(Xi)统(Tong) power system发(Fa)电(Dian)机(Ji) generator励(Li)磁(Ci) excitation励(Li)磁(Ci)器(Qi) excitor电(Dian)压(Ya) voltage电(Dian)流(Liu) current母(Mu)线(Xian) bus变(Bian)压(Ya)器(Qi) transformer升(Sheng)压(Ya)变(Bian)压(Ya)器(Qi) step-up transformer高(Gao)压(Ya)侧(Ce) high side输(Shu)电(Dian)系(Xi)统(Tong) power transmission system输(Shu)电(Dian)线(Xian) transmission line固(Gu)定(Ding)串(Chuan)联(Lian)电(Dian)容(Rong)补(Bu)偿(Chang)fixed series capacitor compensation稳(Wen)定(Ding) stability电(Dian)压(Ya)稳(Wen)定(Ding) voltage stability功(Gong)角(Jiao)稳(Wen)定(Ding) angle stability暂(Zan)态(Tai)稳(Wen)定(Ding) transient stability电(Dian)厂(Chang) power plant能(Neng)量(Liang)输(Shu)送(Song) power transfer交(Jiao)流(Liu) AC装(Zhuang)机(Ji)容(Rong)量(Liang) installed capacity电(Dian)网(Wang) power system落(Luo)点(Dian) drop point开(Kai)关(Guan)站(Zhan) switch station双(Shuang)回(Hui)同(Tong)杆(Gan)并(Bing)架(Jia) double-circuit lines on the same tower变(Bian)电(Dian)站(Zhan) transformer substation补(Bu)偿(Chang)度(Du) degree of compensation高(Gao)抗(Kang) high voltage shunt reactor无(Wu)功(Gong)补(Bu)偿(Chang) reactive power compensation故(Gu)障(Zhang) fault调(Diao)节(Jie) regulation裕(Yu)度(Du) magin三(San)相(Xiang)故(Gu)障(Zhang) three phase fault故(Gu)障(Zhang)切(Qie)除(Chu)时(Shi)间(Jian) fault clearing time极(Ji)限(Xian)切(Qie)除(Chu)时(Shi)间(Jian) critical clearing time切(Qie)机(Ji) generator triping高(Gao)顶(Ding)值(Zhi) high limited value强(Qiang)行(Xing)励(Li)磁(Ci) reinforced excitation线(Xian)路(Lu)补(Bu)偿(Chang)器(Qi) LDC(line drop compensation)机(Ji)端(Duan) generator terminal静(Jing)态(Tai) static (state)动(Dong)态(Tai) dynamic (state)单(Dan)机(Ji)无(Wu)穷(Qiong)大(Da)系(Xi)统(Tong) one machine - infinity bus system机(Ji)端(Duan)电(Dian)压(Ya)控(Kong)制(Zhi) AVR电(Dian)抗(Kang) reactance电(Dian)阻(Zu) resistance功(Gong)角(Jiao) power angle有(You)功(Gong)（功(Gong)率(Lv)） active power无(Wu)功(Gong)（功(Gong)率(Lv)） reactive power功(Gong)率(Lv)因(Yin)数(Shu) power factor无(Wu)功(Gong)电(Dian)流(Liu) reactive current下(Xia)降(Jiang)特(Te)性(Xing) droop characteristics斜(Xie)率(Lv) slope额(E)定(Ding) rating变(Bian)比(Bi) ratio参(Can)考(Kao)值(Zhi) reference value电(Dian)压(Ya)互(Hu)感(Gan)器(Qi) PT分(Fen)接(Jie)头(Tou) tap下(Xia)降(Jiang)率(Lv) droop rate仿(Fang)真(Zhen)分(Fen)析(Xi) simulation analysis传(Chuan)递(Di)函(Han)数(Shu) transfer function框(Kuang)图(Tu) block diagram受(Shou)端(Duan) receive-side裕(Yu)度(Du) margin同(Tong)步(Bu) synchronization失(Shi)去(Qu)同(Tong)步(Bu) loss of synchronization阻(Zu)尼(Ni) damping摇(Yao)摆(Bai) swing保(Bao)护(Hu)断(Duan)路(Lu)器(Qi) circuit breaker电(Dian)阻(Zu)：resistance电(Dian)抗(Kang)：reactance阻(Zu)抗(Kang)：impedance电(Dian)导(Dao)：conductance电(Dian)纳(Na)：susceptance导(Dao)纳(Na)：admittance电(Dian)感(Gan)：inductance电(Dian)容(Rong): capacitancePCB板(Ban)述(Shu)语(Yu)印(Yin)制(Zhi)电(Dian)路(Lu)printed circuit印(Yin)制(Zhi)线(Xian)路(Lu) printed wiring印(Yin)制(Zhi)板(Ban) printed board印(Yin)制(Zhi)板(Ban)电(Dian)路(Lu) printed circuit board印(Yin)制(Zhi)线(Xian)路(Lu)板(Ban) printed wiring board印(Yin)制(Zhi)元(Yuan)件(Jian) printed component印(Yin)制(Zhi)接(Jie)点(Dian) printed contact印(Yin)制(Zhi)板(Ban)装(Zhuang)配(Pei) printed board assembly板(Ban) board刚(Gang)性(Xing)印(Yin)制(Zhi)板(Ban) rigid printed board挠(Nao)性(Xing)印(Yin)制(Zhi)电(Dian)路(Lu) flexible printed circuit挠(Nao)性(Xing)印(Yin)制(Zhi)线(Xian)路(Lu) flexible printed wiring齐(Qi)平(Ping)印(Yin)制(Zhi)板(Ban) flush printed board金(Jin)属(Shu)芯(Xin)印(Yin)制(Zhi)板(Ban) metal core printed board金(Jin)属(Shu)基(Ji)印(Yin)制(Zhi)板(Ban) metal base printed board多(Duo)重(Zhong)布(Bu)线(Xian)印(Yin)制(Zhi)板(Ban) mulit-wiring printed board塑(Su)电(Dian)路(Lu)板(Ban) molded circuit board散(San)线(Xian)印(Yin)制(Zhi)板(Ban) discrete wiring board微(Wei)线(Xian)印(Yin)制(Zhi)板(Ban) micro wire board积(Ji)层(Ceng)印(Yin)制(Zhi)板(Ban) buile-up printed board表(Biao)面(Mian)层(Ceng)合(He)电(Dian)路(Lu)板(Ban) surface laminar circuit埋(Mai)入(Ru)凸(Tu)块(Kuai)连(Lian)印(Yin)制(Zhi)板(Ban) B2it printed board载(Zai)芯(Xin)片(Pian)板(Ban) chip on board埋(Mai)电(Dian)阻(Zu)板(Ban) buried resistance board母(Mu)板(Ban) mother board子(Zi)板(Ban) daughter board背(Bei)板(Ban) backplane裸(Luo)板(Ban) bare board键(Jian)盘(Pan)板(Ban)夹(Jia)心(Xin)板(Ban) copper-invar-copper board动(Dong)态(Tai)挠(Nao)性(Xing)板(Ban) dynamic flex board静(Jing)态(Tai)挠(Nao)性(Xing)板(Ban) static flex board可(Ke)断(Duan)拼(Pin)板(Ban) break-away planel电(Dian)缆(Lan) cable挠(Nao)性(Xing)扁(Bian)平(Ping)电(Dian)缆(Lan) flexible flat cable (FFC)薄(Bao)膜(Mo)开(Kai)关(Guan) membrane switch混(Hun)合(He)电(Dian)路(Lu) hybrid circuit厚(Hou)膜(Mo) thick film厚(Hou)膜(Mo)电(Dian)路(Lu) thick film circuit薄(Bao)膜(Mo) thin film薄(Bao)膜(Mo)混(Hun)合(He)电(Dian)路(Lu) thin film hybrid circuit互(Hu)连(Lian) interconnection导(Dao)线(Xian) conductor trace line齐(Qi)平(Ping)导(Dao)线(Xian) flush conductor传(Chuan)输(Shu)线(Xian) transmission line跨(Kua)交(Jiao) crossover板(Ban)边(Bian)插(Cha)头(Tou) edge-board contact增(Zeng)强(Qiang)板(Ban) stiffener基(Ji)底(Di) substrate基(Ji)板(Ban)面(Mian) real estate导(Dao)线(Xian)面(Mian) conductor side元(Yuan)件(Jian)面(Mian) component side焊(Han)接(Jie)面(Mian) solder side导(Dao)电(Dian)图(Tu)形(Xing) conductive pattern非(Fei)导(Dao)电(Dian)图(Tu)形(Xing) non-conductive pattern基(Ji)材(Cai) base material层(Ceng)压(Ya)板(Ban) laminate覆(Fu)金(Jin)属(Shu)箔(Bo)基(Ji)材(Cai) metal-clad bade material覆(Fu)铜(Tong)箔(Bo)层(Ceng)压(Ya)板(Ban) copper-clad laminate (CCL)复(Fu)合(He)层(Ceng)压(Ya)板(Ban) composite laminate薄(Bao)层(Ceng)压(Ya)板(Ban) thin laminate基(Ji)体(Ti)材(Cai)料(Liao) basis material预(Yu)浸(Jin)材(Cai)料(Liao) prepreg粘(Zhan)结(Jie)片(Pian) bonding sheet预(Yu)浸(Jin)粘(Zhan)结(Jie)片(Pian) preimpregnated bonding sheer环(Huan)氧(Yang)玻(Bo)璃(Li)基(Ji)板(Ban) epoxy glass substrate预(Yu)制(Zhi)内(Nei)层(Ceng)覆(Fu)箔(Bo)板(Ban) mass lamination panel内(Nei)层(Ceng)芯(Xin)板(Ban) core material粘(Zhan)结(Jie)层(Ceng) bonding layer粘(Zhan)结(Jie)膜(Mo) film adhesive无(Wu)支(Zhi)撑(Cheng)胶(Jiao)粘(Zhan)剂(Ji)膜(Mo) unsupported adhesive film覆(Fu)盖(Gai)层(Ceng) cover layer (cover lay)增(Zeng)强(Qiang)板(Ban)材(Cai) stiffener material铜(Tong)箔(Bo)面(Mian) copper-clad surface去(Qu)铜(Tong)箔(Bo)面(Mian) foil removal surface层(Ceng)压(Ya)板(Ban)面(Mian) unclad laminate surface基(Ji)膜(Mo)面(Mian) base film surface胶(Jiao)粘(Zhan)剂(Ji)面(Mian) adhesive faec原(Yuan)始(Shi)光(Guang)洁(Jie)面(Mian) plate finish粗(Cu)面(Mian) matt finish剪(Jian)切(Qie)板(Ban) cut to size panel超(Chao)薄(Bao)型(Xing)层(Ceng)压(Ya)板(Ban) ultra thin laminateA阶(Jie)树(Shu)脂(Zhi) A-stage resinB阶(Jie)树(Shu)脂(Zhi) B-stage resinC阶(Jie)树(Shu)脂(Zhi) C-stage resin环(Huan)氧(Yang)树(Shu)脂(Zhi) epoxy resin酚(Fen)醛(Quan)树(Shu)脂(Zhi) phenolic resin聚(Ju)酯(Zuo)树(Shu)脂(Zhi) polyester resin聚(Ju)酰(Zuo)亚(Ya)胺(An)树(Shu)脂(Zhi) polyimide resin双(Shuang)马(Ma)来(Lai)酰(Zuo)亚(Ya)胺(An)三(San)嗪(Zuo)树(Shu)脂(Zhi) bismaleimide-triazine resin丙(Bing)烯(Xi)酸(Suan)树(Shu)脂(Zhi) acrylic resin三(San)聚(Ju)氰(Qing)胺(An)甲(Jia)醛(Quan)树(Shu)脂(Zhi) melamine formaldehyde resin多(Duo)官(Guan)能(Neng)环(Huan)氧(Yang)树(Shu)脂(Zhi) polyfunctional epoxy resin溴(Zuo)化(Hua)环(Huan)氧(Yang)树(Shu)脂(Zhi) brominated epoxy resin环(Huan)氧(Yang)酚(Fen)醛(Quan) epoxy novolac氟(Fu)树(Shu)脂(Zhi) fluroresin硅(Gui)树(Shu)脂(Zhi) silicone resin硅(Gui)烷(Wan) silane聚(Ju)合(He)物(Wu) polymer无(Wu)定(Ding)形(Xing)聚(Ju)合(He)物(Wu) amorphous polymer结(Jie)晶(Jing)现(Xian)象(Xiang) crystalline polamer双(Shuang)晶(Jing)现(Xian)象(Xiang) dimorphism共(Gong)聚(Ju)物(Wu) copolymer合(He)成(Cheng)树(Shu)脂(Zhi) synthetic热(Re)固(Gu)性(Xing)树(Shu)脂(Zhi) thermosetting resin [Page]热(Re)塑(Su)性(Xing)树(Shu)脂(Zhi) thermoplastic resin感(Gan)光(Guang)性(Xing)树(Shu)脂(Zhi) photosensitive resin环(Huan)氧(Yang)值(Zhi) epoxy value双(Shuang)氰(Qing)胺(An) dicyandiamide粘(Zhan)结(Jie)剂(Ji) binder胶(Jiao)粘(Zhan)剂(Ji) adesive固(Gu)化(Hua)剂(Ji) curing agent阻(Zu)燃(Ran)剂(Ji) flame retardant遮(Zhe)光(Guang)剂(Ji) opaquer增(Zeng)塑(Su)剂(Ji) plasticizers不(Bu)饱(Bao)和(He)聚(Ju)酯(Zuo) unsatuiated polyester聚(Ju)酯(Zuo)薄(Bao)膜(Mo) polyester聚(Ju)酰(Zuo)亚(Ya)胺(An)薄(Bao)膜(Mo) polyimide film (PI)聚(Ju)四(Si)氟(Fu)乙(Yi)烯(Xi) polytetrafluoetylene (PTFE)增(Zeng)强(Qiang)材(Cai)料(Liao) reinforcing material折(Zhe)痕(Hen) crease云(Yun)织(Zhi) waviness鱼(Yu)眼(Yan) fish eye毛(Mao)圈(Quan)长(Chang) feather length厚(Hou)薄(Bao)段(Duan) mark裂(Lie)缝(Feng) split捻(Nian)度(Du) twist of yarn浸(Jin)润(Run)剂(Ji)含(Han)量(Liang) size content浸(Jin)润(Run)剂(Ji)残(Can)留(Liu)量(Liang) size residue处(Chu)理(Li)剂(Ji)含(Han)量(Liang) finish level偶(Ou)联(Lian)剂(Ji) couplint agent断(Duan)裂(Lie)长(Chang) breaking length吸(Xi)水(Shui)高(Gao)度(Du) height of capillary rise湿(Shi)强(Qiang)度(Du)保(Bao)留(Liu)率(Lv) wet strength retention白(Bai)度(Du) whitenness导(Dao)电(Dian)箔(Bo) conductive foil铜(Tong)箔(Bo) copper foil压(Ya)延(Yan)铜(Tong)箔(Bo) rolled copper foil光(Guang)面(Mian) shiny side粗(Cu)糙(Cao)面(Mian) matte side处(Chu)理(Li)面(Mian) treated side防(Fang)锈(Xiu)处(Chu)理(Li) stain proofing双(Shuang)面(Mian)处(Chu)理(Li)铜(Tong)箔(Bo) double treated foil模(Mo)拟(Ni) simulation逻(Luo)辑(Ji)模(Mo)拟(Ni) logic simulation电(Dian)路(Lu)模(Mo)拟(Ni) circit simulation时(Shi)序(Xu)模(Mo)拟(Ni) timing simulation模(Mo)块(Kuai)化(Hua) modularization设(She)计(Ji)原(Yuan)点(Dian) design origin优(You)化(Hua)（设(She)计(Ji)） optimization (design)供(Gong)设(She)计(Ji)优(You)化(Hua)坐(Zuo)标(Biao)轴(Zhou) predominant axis表(Biao)格(Ge)原(Yuan)点(Dian) table origin元(Yuan)件(Jian)安(An)置(Zhi) component positioning比(Bi)例(Li)因(Yin)子(Zi) scaling factor扫(Sao)描(Miao)填(Tian)充(Chong) scan filling矩(Ju)形(Xing)填(Tian)充(Chong) rectangle filling填(Tian)充(Chong)域(Yu) region filling实(Shi)体(Ti)设(She)计(Ji) physical design逻(Luo)辑(Ji)设(She)计(Ji) logic design逻(Luo)辑(Ji)电(Dian)路(Lu) logic circuit层(Ceng)次(Ci)设(She)计(Ji) hierarchical design自(Zi)顶(Ding)向(Xiang)下(Xia)设(She)计(Ji) top-down design自(Zi)底(Di)向(Xiang)上(Shang)设(She)计(Ji) bottom-up design费(Fei)用(Yong)矩(Ju)阵(Zhen) cost metrix元(Yuan)件(Jian)密(Mi)度(Du) component density自(Zi)由(You)度(Du) degrees freedom出(Chu)度(Du) out going degree入(Ru)度(Du) incoming degree曼(Man)哈(Ha)顿(Dun)距(Ju)离(Li) manhatton distance欧(Ou)几(Ji)里(Li)德(De)距(Ju)离(Li) euclidean distance网(Wang)络(Luo) network阵(Zhen)列(Lie) array段(Duan) segment逻(Luo)辑(Ji) logic逻(Luo)辑(Ji)设(She)计(Ji)自(Zi)动(Dong)化(Hua) logic design automation分(Fen)线(Xian) separated time分(Fen)层(Ceng) separated layer定(Ding)顺(Shun)序(Xu) definite sequence导(Dao)线(Xian)（通(Tong)道(Dao)） conduction (track)导(Dao)线(Xian)（体(Ti)）宽(Kuan)度(Du) conductor width导(Dao)线(Xian)距(Ju)离(Li) conductor spacing导(Dao)线(Xian)层(Ceng) conductor layer导(Dao)线(Xian)宽(Kuan)度(Du)/间(Jian)距(Ju) conductor line/space第(Di)一(Yi)导(Dao)线(Xian)层(Ceng) conductor layer No.1圆(Yuan)形(Xing)盘(Pan) round pad方(Fang)形(Xing)盘(Pan) square pad菱(Ling)形(Xing)盘(Pan) diamond pad长(Chang)方(Fang)形(Xing)焊(Han)盘(Pan) oblong pad子(Zi)弹(Dan)形(Xing)盘(Pan) bullet pad泪(Lei)滴(Di)盘(Pan) teardrop pad雪(Xue)人(Ren)盘(Pan) snowman pad形(Xing)盘(Pan) V-shaped pad V环(Huan)形(Xing)盘(Pan) annular pad非(Fei)圆(Yuan)形(Xing)盘(Pan) non-circular pad隔(Ge)离(Li)盘(Pan) isolation pad非(Fei)功(Gong)能(Neng)连(Lian)接(Jie)盘(Pan) monfunctional pad偏(Pian)置(Zhi)连(Lian)接(Jie)盘(Pan) offset land腹(Fu)（背(Bei)）裸(Luo)盘(Pan) back-bard land盘(Pan)址(Zhi) anchoring spaur连(Lian)接(Jie)盘(Pan)图(Tu)形(Xing) land pattern连(Lian)接(Jie)盘(Pan)网(Wang)格(Ge)阵(Zhen)列(Lie) land grid array孔(Kong)环(Huan) annular ring元(Yuan)件(Jian)孔(Kong) component hole安(An)装(Zhuang)孔(Kong) mounting hole支(Zhi)撑(Cheng)孔(Kong) supported hole非(Fei)支(Zhi)撑(Cheng)孔(Kong) unsupported hole导(Dao)通(Tong)孔(Kong) via镀(Du)通(Tong)孔(Kong) plated through hole (PTH)余(Yu)隙(Xi)孔(Kong) access hole盲(Mang)孔(Kong) blind via (hole)埋(Mai)孔(Kong) buried via hole埋(Mai),盲(Mang)孔(Kong) buried blind via任(Ren)意(Yi)层(Ceng)内(Nei)部(Bu)导(Dao)通(Tong)孔(Kong) any layer inner via hole全(Quan)部(Bu)钻(Zuan)孔(Kong) all drilled hole定(Ding)位(Wei)孔(Kong) toaling hole无(Wu)连(Lian)接(Jie)盘(Pan)孔(Kong) landless hole中(Zhong)间(Jian)孔(Kong) interstitial hole无(Wu)连(Lian)接(Jie)盘(Pan)导(Dao)通(Tong)孔(Kong) landless via hole引(Yin)导(Dao)孔(Kong) pilot hole端(Duan)接(Jie)全(Quan)隙(Xi)孔(Kong) terminal clearomee hole准(Zhun)尺(Chi)寸(Cun)孔(Kong) dimensioned hole [Page]在(Zai)连(Lian)接(Jie)盘(Pan)中(Zhong)导(Dao)通(Tong)孔(Kong) via-in-pad孔(Kong)位(Wei) hole location孔(Kong)密(Mi)度(Du) hole density孔(Kong)图(Tu) hole pattern钻(Zuan)孔(Kong)图(Tu) drill drawing装(Zhuang)配(Pei)图(Tu)assembly drawing参(Can)考(Kao)基(Ji)准(Zhun) datum referan
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